Processing

Please wait...

Settings

Settings

Goto Application

1. WO2002023276 - NEGATIVE PHOTOSENSITIVE POLYIMIDE COMPOSITION AND METHOD OF FORMING IMAGE FROM THE SAME

Publication Number WO/2002/023276
Publication Date 21.03.2002
International Application No. PCT/JP2001/007876
International Filing Date 11.09.2001
Chapter 2 Demand Filed 12.04.2002
IPC
C08L 79/08 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
79Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08L61/-C08L77/259
04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
G03F 7/037 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
032with binders
037the binders being polyamides or polyimides
G03F 7/038 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
038Macromolecular compounds which are rendered insoluble or differentially wettable
CPC
C08L 79/08
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
79Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
G03F 7/037
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
032with binders
037the binders being polyamides or polyimides
G03F 7/0387
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
038Macromolecular compounds which are rendered insoluble or differentially wettable
0387Polyamides or polyimides
Y10S 430/114
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
430Radiation imagery chemistry: process, composition, or product thereof
1053Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
1055Radiation sensitive composition or product or process of making
114Initiator containing
Y10S 430/117
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
430Radiation imagery chemistry: process, composition, or product thereof
1053Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
1055Radiation sensitive composition or product or process of making
114Initiator containing
117Free radical
Applicants
  • PI R & D CO., LTD. [JP]/[JP] (AllExceptUS)
  • ITATANI, Hiroshi [JP]/[JP] (UsOnly)
  • MATSUMOTO, Shunichi [JP]/[JP] (UsOnly)
Inventors
  • ITATANI, Hiroshi
  • MATSUMOTO, Shunichi
Agents
  • TANIGAWA, Hidejiro
Priority Data
2000-31860712.09.2000JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) NEGATIVE PHOTOSENSITIVE POLYIMIDE COMPOSITION AND METHOD OF FORMING IMAGE FROM THE SAME
(FR) COMPOSITION PHOTOSENSIBLE DE POLYIMIDE POUR NEGATIF ET PROCEDE DE FORMATION D'IMAGE ASSOCIEE
Abstract
(EN)
A negative photosensitive polyimide composition which is soluble in organic solvents, is excellent in adhesion, heat resistance, mechanical properties, and flexibility, and gives a highly sensitive negative photoresist which becomes alkali-soluble upon light irradiation. The composition comprises a photo-radical generator and a solvent-soluble polyimide showing negative photosensitivity in the presence of either an olefin or the photo-radical generator.
(FR)
L'invention porte sur une composition photosensible de polyimide pour négatif, soluble dans des solvants organiques, d'une excellente adhérence, résistant à la chaleur, d'une bonne résistance mécanique, souple, et constituant une pellicule photorésistante pour négatif, hautement sensible, et devenant soluble dans un liquide alcalin après irradiation par la lumière. Ladite composition comporte un générateur de photoradicaux et un polyimide soluble dans un solvant et présentant une photosensibilité négative en présence soit d'une oléfine, soit du générateur de photoradicaux.
Latest bibliographic data on file with the International Bureau