Processing

Please wait...

Settings

Settings

Goto Application

1. WO2002019427 - INTEGRATED CIRCUIT PACKAGE INCORPORATING CAMOUFLAGED PROGRAMMABLE ELEMENTS

Publication Number WO/2002/019427
Publication Date 07.03.2002
International Application No. PCT/US2001/024678
International Filing Date 06.08.2001
Chapter 2 Demand Filed 18.02.2002
IPC
H01L 23/538 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
52Arrangements for conducting electric current within the device in operation from one component to another
538the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 23/58 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
58Structural electrical arrangements for semiconductor devices not otherwise provided for
CPC
H01L 2221/68359
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2221Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
683for supporting or gripping
68304using temporarily an auxiliary support
68359used as a support during manufacture of interconnect decals or build up layers
H01L 2224/16225
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
161Disposition
16151the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
16221the body and the item being stacked
16225the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L 23/5382
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
52Arrangements for conducting electric current within the device in operation from one component to another ; , i.e. interconnections, e.g. wires, lead frames
538the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
5382Adaptable interconnections, e.g. for engineering changes
H01L 23/57
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
57Protection from inspection, reverse engineering or tampering
H01L 2924/00014
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
00014the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Y10S 257/922
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
257Active solid-state devices, e.g. transistors, solid-state diodes
922with means to prevent inspection of or tampering with an integrated circuit, e.g. "smart card", anti-tamper
Applicants
  • ADVANCED MICRO DEVICES, INC. [US]/[US]
Inventors
  • NGUYEN, Quang, D.
  • ANDERSON, Charles
  • CASTO, James, J.
  • TAIN, Alexander, C.
Agents
  • RODDY, Richard, J.
  • BROOKES BATCHELLOR
Priority Data
09/651,89330.08.2000US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) INTEGRATED CIRCUIT PACKAGE INCORPORATING CAMOUFLAGED PROGRAMMABLE ELEMENTS
(FR) BOITIER DE CIRCUIT INTEGRE A ELEMENTS PROGRAMMABLES DISSIMULES
Abstract
(EN)
An integrated circuit package includes at least one one-time programmable element, such as a fuse, having a first end and a second end separated by a programmable link. The programmable element is positioned on a surface other than the top surface, e.g., a side surface or the bottom surface of the package substrate to render them less conspicuous to unscrupulous suppliers intent on tampering with the package. The information programmed by the fuses may relate to speed or voltage ratings for a microprocessor.
(FR)
L'invention concerne un boîtier de circuit intégré comprenant au moins un élément programmable uniservice, tel qu'un fusible, possédant une première extrémité et une seconde extrémité séparées par une liaison programmable. L'élément programmable est placé sur une surface autre que la surface supérieure, une surface latérale ou la surface inférieure du substrat du boîtier, par exemple, pour être moins à la portée des fournisseurs peu scrupuleux qui voudraient trafiquer le boîtier. Les informations programmées par les fusibles peuvent être associées à des évaluation de la vitesse ou à des tensions nominales d'un microprocesseur.
Also published as
Latest bibliographic data on file with the International Bureau