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1. WO2002018493 - CURABLE RESIN COMPOSITION

Publication Number WO/2002/018493
Publication Date 07.03.2002
International Application No. PCT/JP2000/005883
International Filing Date 30.08.2000
Chapter 2 Demand Filed 11.10.2000
IPC
C08K 5/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5Use of organic ingredients
C08K 5/3492 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5Use of organic ingredients
16Nitrogen-containing compounds
34Heterocyclic compounds having nitrogen in the ring
3467having more than two nitrogen atoms in the ring
3477Six-membered rings
3492Triazines
C08K 5/5313 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5Use of organic ingredients
49Phosphorus-containing compounds
51Phosphorus bound to oxygen
53bound to oxygen and to carbon only
5313Phosphinic compounds, e.g. R2=P(:O)OR'
H05K 1/00 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
CPC
C08K 5/0025
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
5Use of organic ingredients
0008Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
0025Crosslinking or vulcanising agents; including accelerators
C08K 5/34928
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
5Use of organic ingredients
16Nitrogen-containing compounds
34Heterocyclic compounds having nitrogen in the ring
3467having more than two nitrogen atoms in the ring
3477Six-membered rings
3492Triazines
34928Salts
C08K 5/5313
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
5Use of organic ingredients
49Phosphorus-containing compounds
51Phosphorus bound to oxygen
53bound to oxygen and to carbon only
5313Phosphinic compounds, e.g. R2=P(:O)OR'
H05K 3/4676
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multilayer circuits
4644by building the multilayer layer by layer, i.e. build-up multilayer circuits
4673Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
4676Single layer compositions
Applicants
  • ASAHI KASEI KABUSHIKI KAISHA [JP]/[JP] (AllExceptUS)
  • YORISUE, Tomohiro [JP]/[JP] (UsOnly)
  • KATAYOSE, Teruo [JP]/[JP] (UsOnly)
Inventors
  • YORISUE, Tomohiro
  • KATAYOSE, Teruo
Agents
  • ASAMURA, Kiyoshi
Priority Data
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CURABLE RESIN COMPOSITION
(FR) COMPOSITION DE RESINE DURCISSABLE
Abstract
(EN)
A curable resin composition which comprises a polyphenylene ether resin, a crosslinking agent, and at least one phosphorus compound selected from the group consisting of melamine polyphosphates having a degree of polymerization of 3 or higher and 9,10-dihydro-9-oxa-10-phosphaphenanthrene 10-oxide derivatives having a reactive substituent, the amounts of the polyphenylene ether resin, the crosslinking agent, and the phosphorus compound being 10 to 98 parts by weight, 90 to 2 parts by weight, and 10 to 80 parts by weight, respectively, per 100 parts by weight of the sum of the polyphenylene ether resin and the crosslinking agent; a cured object of the composition; a curable composite material comprising the curable resin composition and a substrate; and a cured object of the composite material. The curable resin composition retains the heat resistance characteristic of the polyphenylene ether resin and has sufficient flame retardancy although halogen-free.
(FR)
La présente invention concerne une composition de résine durcissable comprenant une résine polyphénylène éther, un agent de réticulation, et au moins un composé de phosphore choisi parmi le groupe comprenant les mélamine polyphosphates ayant un degré de polymérisation de 3 ou plus, et les dérivés de 9,10-dihydro-9-oxa-10-phosphaphénanthrène-10-oxyde comprenant un substituant réactif, les quantités de résine polyphénylène éther, agent de réticulation, et composé de phosphore valant de 10 à 98 parties pondérales, de 90 à 2 parties pondérales, et de 10 à 80 parties pondérales respectivement, pour cent parties pondérales représentées par la somme de la résine polyphénylène éther et de l'agent de réticulation. Cette invention concerne également un article durci constitué de ladite composition, un matériau composite durcissable comprenant ladite composition de résine durcissable et un substrat; et un article durci constitué dudit matériau composite. La composition de résine durcissable conserve la caractéristique de résistance à la chaleur de la résine polyphénylène éther et s'avère suffisamment ignifugeante malgré l'absence d'halogène.
Also published as
Latest bibliographic data on file with the International Bureau