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1. WO2002018085 - RAPID SURFACE COOLING OF SOLDER DROPLETS BY FLASH EVAPORATION

Publication Number WO/2002/018085
Publication Date 07.03.2002
International Application No. PCT/US2001/027326
International Filing Date 31.08.2001
Chapter 2 Demand Filed 01.04.2002
IPC
B23K 3/06 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
3Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
06Solder feeding devices; Solder melting pans
CPC
B23K 3/0607
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
3Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
06Solder feeding devices; Solder melting pans
0607Solder feeding devices
B23K 3/0623
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
3Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
06Solder feeding devices; Solder melting pans
0607Solder feeding devices
0623for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
Applicants
  • FRY'S METALS, INC. D/B/A ALPHA METALS, INC. [US]/[US] (AllExceptUS)
  • MINOGUE, Gerard, R. [US]/[US] (UsOnly)
Inventors
  • MINOGUE, Gerard, R.
Agents
  • MIRABITO, A., Jason
Priority Data
60/230,28401.09.2000US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) RAPID SURFACE COOLING OF SOLDER DROPLETS BY FLASH EVAPORATION
(FR) REFROIDISSEMENT RAPIDE DES SURFACES DES GOUTTELETTES DE SOUDURE PAR EVAPORATION FLASH
Abstract
(EN)
A mist of liquid coolant is introduced into the path of atomized, molten, solder droplets. The mist and other conditions within the chamber are engineered to enable the liquid coolant droplets in the mist to contract the surfaces of molten solder droplets and be flash vaporized upon contact, thereby rapidly extracting heat from the molten solder droplets and accelerating cooling and solidification to produce an enhanced solder ball as a product of this process.
(FR)
Dans cette invention, on injecte une buée de liquide de refroidissement dans le trajet de gouttelettes de soudure atomisées et fondues. Cette buée et d'autres conditions présentes dans la chambre sont conçues pour permettre aux gouttelettes du liquide de refroidissement de la buée de venir en contatc avec les surfaces des gouttelettes de soudures fondues et de subir ainsi une évaporation flash. Ceci permet d'extraire rapidement la chaleur des gouttelettes de soudures fondues et d'accélérer le refroidissement et la solidification de ces dernières de manière à obtenir des globules de soudures améliorées.
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