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1. WO2002005975 - CLEANING SHEET, CONVEYING MEMBER USING THE SAME, AND SUBSTRATE PROCESSING EQUIPMENT CLEANING METHOD USING THEM

Publication Number WO/2002/005975
Publication Date 24.01.2002
International Application No. PCT/JP2001/003849
International Filing Date 08.05.2001
Chapter 2 Demand Filed 19.12.2001
IPC
B08B 1/00 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
08CLEANING
BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
1Cleaning by methods involving the use of tools, brushes, or analogous members
B08B 7/00 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
08CLEANING
BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
7Cleaning by methods not provided for in a single other subclass or a single group in this subclass
CPC
B08B 1/00
BPERFORMING OPERATIONS; TRANSPORTING
08CLEANING
BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
1Cleaning by methods involving the use of tools, brushes, or analogous members
B08B 7/00
BPERFORMING OPERATIONS; TRANSPORTING
08CLEANING
BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
7Cleaning by methods not provided for in a single other subclass or a single group in this subclass
B08B 7/0028
BPERFORMING OPERATIONS; TRANSPORTING
08CLEANING
BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
7Cleaning by methods not provided for in a single other subclass or a single group in this subclass
0028by adhesive surfaces
H01L 21/304
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
18the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
302to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
Y10T 428/1462
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
428Stock material or miscellaneous articles
14Layer or component removable to expose adhesive
1462Polymer derived from material having at least one acrylic or alkacrylic group or the nitrile or amide derivative thereof [e.g., acrylamide, acrylate ester, etc.]
Y10T 428/1476
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
428Stock material or miscellaneous articles
14Layer or component removable to expose adhesive
1476Release layer
Applicants
  • NITTO DENKO CORPORATION [JP]/[JP] (AllExceptUS)
  • NAMIKAWA, Makoto [JP]/[JP] (UsOnly)
  • TERADA, Yoshio [JP]/[JP] (UsOnly)
  • TOYODA, Eiji [JP]/[JP] (UsOnly)
Inventors
  • NAMIKAWA, Makoto
  • TERADA, Yoshio
  • TOYODA, Eiji
Agents
  • OGURI, Shohei
Priority Data
2000-21523314.07.2000JP
2000-23034031.07.2000JP
2000-34984016.11.2000JP
2000-39910327.12.2000JP
2001-00463412.01.2001JP
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) CLEANING SHEET, CONVEYING MEMBER USING THE SAME, AND SUBSTRATE PROCESSING EQUIPMENT CLEANING METHOD USING THEM
(FR) FEUILLE DE NETTOYAGE, ELEMENT TRANSPORTEUR UTILISANT LADITE FEUILLE DE NETTOYAGE ET PROCEDE POUR NETTOYER UN EQUIPEMENT DE TRAITEMENT DE SUBSTRATS FAISANT APPEL A LADITE FEUILLE DE NETTOYAGE
Abstract
(EN) A cleaning sheet has a cleaning layer having a surface resistivity not less than 1X1013 $g(V)/$m(c). In a method of manufacturing a conveying member with a cleaning function, for sticking the cleaning sheet, in which the cleaning layer formed of an adhesive that is polymerized/cured by an active energy is provided onto one surface of a base material and an ordinary adhesive layer is provided onto the other surface thereof, onto the conveying member via an ordinary adhesive layer to have a shape larger than the shape of the conveying member and then cutting the cleaning sheet along shape of the conveying member, wherein a polymerizing/curing reaction of the cleaning layer is carried out after the cleaning sheet is cut out into the shape of the conveying member.
(FR) L'invention concerne une feuille de nettoyage présentant une couche de nettoyage dont la résistivité superficielle n'est pas inférieure à 1x1013$g(V)/$m(c). Selon un procédé de production, un élément transporteur à fonction de nettoyage, pour faire adhérer la feuille de nettoyage dans laquelle la couche de nettoyage comprenant un adhésif qui est polymérisé/cuit par énergie active est prévue sur une surface de matériau de base et une couche adhésive ordinaire est prévue sur son autre surface, sur l'élément transporteur par le biais d'une couche adhésive ordinaire, afin d'adopter une forme plus importante que celle de l'élément transporteur. Il est ensuite prévu de découper la feuille de nettoyage le long de la forme de l'élément transporteur. Une réaction de polymérisation/cuisson de la couche de nettoyage intervient une fois la feuille de nettoyage découpée à la forme de l'élément transporteur.
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