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Machine translation
1. (WO2002004134) THERMAL PROCESSING SYSTEM AND METHODS FOR FORMING LOW-K DIELECTRIC FILMS SUITABLE FOR INCORPORATION INTO MICROELECTRONIC DEVICES
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2002/004134    International Application No.:    PCT/US2001/021927
Publication Date: 17.01.2002 International Filing Date: 11.07.2001
Chapter 2 Demand Filed:    08.02.2002    
IPC:
H01L 21/00 (2006.01), H01L 21/02 (2006.01), H01L 21/312 (2006.01), H01L 21/316 (2006.01)
Applicants: FSI INTERNATIONAL, INC. [US/US]; 322 Lake Hazeltine Drive, Chaska, MN 55318 (US)
Inventors: KUMAR, Devendra; (US).
WOMACK, Jeffrey, D.; (US).
NGUYEN, Vuong, P.; (US).
KASAHARA, Jack, S.; (US).
IBRANI, Sokol; (US)
Agent: KAGAN, David, B.; Kagan Binder, PLLC, Suite 200, Maple Island Building, 221 Main Street North, Stillwater, MN 55082 (US)
Priority Data:
60/325,784 12.07.2000 US
Title (EN) THERMAL PROCESSING SYSTEM AND METHODS FOR FORMING LOW-K DIELECTRIC FILMS SUITABLE FOR INCORPORATION INTO MICROELECTRONIC DEVICES
(FR) SYSTEME DE TRAITEMENT THERMIQUE ET METHODES PERMETTANT DE FORMER DES FILMS DIELECTRIQUES A FAIBLE COEFFICIENT K APPROPRIES POUR ETRE INTEGRES DANS DES DISPOSITIFS MICRO-ELECTRONIQUES
Abstract: front page image
(EN)Single wafer processing methods and systems for manufacturing films having low-k properties and low indices of refraction. The methods incorporate a processing station in which both curing and post-cure, in situ gas cooling takes place.
(FR)L'invention concerne des procédés et des systèmes de traitement simple tranche permettant de fabriquer des films ayant des propriétés de faible coefficient k et de faibles indices de réfraction. Dans ces méthodes, la cuisson, la post-cuisson et le refroidissement du gaz in situ se déroulent dans une station de traitement.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, TZ, UA, UG, UZ, VN, YU, ZA, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)