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1. (WO2002003397) INSULATION MATERIAL FOR USE IN HIGH-FREQUENCY ELECTRONIC PARTS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2002/003397    International Application No.:    PCT/US2001/019993
Publication Date: 10.01.2002 International Filing Date: 21.06.2001
Chapter 2 Demand Filed:    24.01.2002    
IPC:
C08L 79/08 (2006.01), H01B 3/30 (2006.01), H01B 3/44 (2006.01), H05K 1/02 (2006.01), H05K 1/03 (2006.01)
Applicants: 3M INNOVATIVE PROPERTIES COMPANY [US/US]; 3M Center P.O. Box 33427 Saint Paul, MN 55133-3427 (US) (For All Designated States Except US).
KOBAYASHI, Mitsuaki [JP/JP]; (JP) (For US Only).
AYUKAWA, Hiroshi [JP/JP]; (JP) (For US Only)
Inventors: KOBAYASHI, Mitsuaki; (JP).
AYUKAWA, Hiroshi; (JP)
Agent: DAHL, Philip, Y.; Office of Intellectual Property Counsel P.O. Box 33427 Saint Paul, MN 55133-3427 (US)
Priority Data:
2000-198017 30.06.2000 JP
Title (EN) INSULATION MATERIAL FOR USE IN HIGH-FREQUENCY ELECTRONIC PARTS
(FR) MATERIAU D'ISOLATION, UTILE DANS DES ELEMENTS ELECTRONIQUES HAUTE FREQUENCE
Abstract: front page image
(EN)To provide an insulating material that has low dielectric constant and low dielectric loss tangent, and is superior in its processability into thin film.An insulating material for use in high-frequency electronic parts comprising: a matrix component composed of polyimide, and fluorocarbon resin particles uniformly dispersed therein.
(FR)L'invention concerne un procédé de production d'un matériau isolant qui possède une constante diélectrique basse, une tangente basse de perte diélectrique, ainsi qu'une aptitude supérieure à être traité pour former un film mince. L'invention concerne également un matériau isolant conçu pour des éléments électroniques haute fréquence, et comprenant: un composant matriciel composé de polyimide, ainsi que des particules de résine de fluorocarbures dispersées uniformément dans le composant matriciel.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, TZ, UA, UG, US, UZ, VN, YU, ZA, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)