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1. WO2002001636 - PROCESS FOR THE MANUFACTURE OF PRINTED CIRCUIT BOARDS WITH PLATED RESISTORS

Publication Number WO/2002/001636
Publication Date 03.01.2002
International Application No. PCT/US2001/007279
International Filing Date 07.03.2001
Chapter 2 Demand Filed 13.06.2001
IPC
H01C 17/065 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
CRESISTORS
17Apparatus or processes specially adapted for manufacturing resistors
06adapted for coating resistive material on a base
065by thick-film techniques, e.g. serigraphy
H05K 1/16 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
16incorporating printed electric components, e.g. printed resistor, capacitor, inductor
H05K 3/06 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
02in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
06the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
H05K 3/18 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
18using precipitation techniques to apply the conductive material
H05K 3/38 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
38Improvement of the adhesion between the insulating substrate and the metal
CPC
H01C 17/065
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
CRESISTORS
17Apparatus or processes specially adapted for manufacturing resistors
06adapted for coating resistive material on a base
065by thick film techniques, e.g. serigraphy
H01C 17/18
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
CRESISTORS
17Apparatus or processes specially adapted for manufacturing resistors
06adapted for coating resistive material on a base
075by thin film techniques
14by chemical deposition
18without using electric current
H01L 24/05
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
02Bonding areas
04Structure, shape, material or disposition of the bonding areas prior to the connecting process
05of an individual bonding area
H01L 2924/12042
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
10Details of semiconductor or other solid state devices to be connected
11Device type
12Passive devices, e.g. 2 terminal devices
1204Optical Diode
12042LASER
H05K 1/167
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
16incorporating printed electric components, e.g. printed resistor, capacitor, inductor
167incorporating printed resistors
H05K 2201/0344
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
03Conductive materials
0332Structure of the conductor
0335Layered conductors or foils
0344Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
Applicants
  • MACDERMID, INCORPORATED [US]/[US]
Inventors
  • KUKANSKIS, Peter
  • LARSON, Gary, B.
  • BENGSTON, Jon
  • SCHWEIKHER, William
Agents
  • CORDANI, John, L.
Priority Data
09/603,97827.06.2000US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) PROCESS FOR THE MANUFACTURE OF PRINTED CIRCUIT BOARDS WITH PLATED RESISTORS
(FR) PROCEDE DE FABRICATION DE CARTES DE CIRCUITS IMPRIMES A RESISTANCES METALLISEES
Abstract
(EN) A process and product manufactured by the process is revealed whereby resistors (16) can be manufactured integral a printed circuit board (10, 13) by plating the resistors onto an insulative substrate (10). Uniformization of the insulative substrate by etching and oxidation of the plated resistor are revealed as techniques for improving the uniformity and consistency of the plated resistors.
(FR) L'invention concerne un procédé et un produit fabriqué dans lequel les résistances (16) peuvent être fabriquées d'une seule pièce avec une carte de circuit imprimé (10, 13), par métallisation desdites résistantes sur un substrat isolant (10). L'uniformisation du substrat isolant par gravure et oxydation de résistance métallisée est une technique qui permet d'améliorer l'uniformité et la régularité des résistances métallisées.
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