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1. WO2002001612 - MECHANICAL CLAMPER FOR HEATED SUBSTRATES AT DIE ATTACH

Publication Number WO/2002/001612
Publication Date 03.01.2002
International Application No. PCT/US2001/020100
International Filing Date 22.06.2001
Chapter 2 Demand Filed 24.01.2002
IPC
H01L 21/00 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
CPC
H01L 21/52
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
52Mounting semiconductor bodies in containers
H01L 21/67144
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67144Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
Y10T 29/53
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
29Metal working
53Means to assemble or disassemble
Y10T 29/53104
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
29Metal working
53Means to assemble or disassemble
53104Roller or ball bearing
Y10T 29/53961
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
29Metal working
53Means to assemble or disassemble
53961with work-holder for assembly
Y10T 29/53974
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
29Metal working
53Means to assemble or disassemble
53961with work-holder for assembly
53974having means to permit support movement while work is thereon
Applicants
  • ADVANCED MICRO DEVICES, INC. [US]/[US]
Inventors
  • FOONG, Sally, Y., L.
  • HO, Kok, Khoon
Agents
  • RODDY, Richard, J.
  • PICKER, Madelaine M.
Priority Data
09/764,13319.01.2001US
60/214,41728.06.2000US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) MECHANICAL CLAMPER FOR HEATED SUBSTRATES AT DIE ATTACH
(FR) DISPOSITIF DE CALAGE MECANIQUE POUR SUBSTRATS CHAUFFES PENDANT LA FIXATION DES MICROCIRCUITS
Abstract
(EN) An apparatus is provided wherein a substrate is mechanically clamped to a heater block of a die bonder to hold down the heated substrate before and during the die bonding operation, thereby preventing warpage of the substrate. Embodiments include a clamp comprising a plurality of spring-loaded rollers which push down opposing outer edges of the substrate onto the heater block while the substrate is being heated and die bonded. The clamp minimizes warpage of the substrate by pushing the substrate flat onto the heater block, and allows the substrate to be moved into and away from the die bonding area.
(FR) La présente invention concerne un dispositif de calage mécanique servant à maintenir un substrat appliqué contre la platine de chauffe d'une microsoudeuse de microcircuits avant et pendant l'opération de soudage, de façon à prévenir la déformation du substrat. Certains modes de réalisations comportent un calage réalisé à partir d'une pluralité de galets sous charge de ressort appliquant de haut en bas les bords extérieurs opposés du substrat contre la platine de chauffe pendant le chauffage du substrat et le microsoudage. Ce calage, qui ramène à un minimum la déformation du substrat dans la mesure où il est maintenu à plat contre la platine de chauffe, permet de placer le substrat dans la zone de soudage et de l'en retirer.
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