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1. WO2002001610 - APPARATUS AND METHOD FOR ELECTRO CHEMICAL DEPOSITION

Publication Number WO/2002/001610
Publication Date 03.01.2002
International Application No. PCT/US2001/018727
International Filing Date 08.06.2001
Chapter 2 Demand Filed 17.01.2002
IPC
C25D 7/12 2006.1
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
7Electroplating characterised by the article coated
12Semiconductors
C25D 21/14 2006.1
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
21Processes for servicing or operating cells for electrolytic coating
12Process control or regulation
14Controlled addition of electrolyte components
C25D 21/18 2006.1
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
21Processes for servicing or operating cells for electrolytic coating
16Regeneration of process solutions
18of electrolytes
CPC
C25D 17/001
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
17Constructional parts, or assemblies thereof, of cells for electrolytic coating
001Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
C25D 21/14
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
21Processes for servicing or operating cells for electrolytic coating
12Process control or regulation
14Controlled addition of electrolyte components
C25D 21/18
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
21Processes for servicing or operating cells for electrolytic coating
16Regeneration of process solutions
18of electrolytes
C25D 7/123
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
7Electroplating characterised by the article coated
12Semiconductors
123Semiconductors first coated with a seed layer or a conductive layer
Applicants
  • APPLIED MATERIALS, INC. [US]/[US]
Inventors
  • STEVENS, Joseph, J.
  • RABINOVICH, Yevgeniy
  • CHAO, Sandy, S.
  • DENOME, Mark, R.
  • D'AMBRA, Allen, L.
  • OLGADO, Donald, J.
Agents
  • BERNADICOU, Michael, A.
Priority Data
09/603,79126.06.2000US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) APPARATUS AND METHOD FOR ELECTRO CHEMICAL DEPOSITION
(FR) APPAREIL ET PROCEDE DE DEPOT ELECTROCHIMIQUE
Abstract
(EN) A system is provided in which a smaller flow of deposition solution is diverted from a larger flow of deposition solution flowing on an electro-chemical deposition tool platform. The smaller flow is diverted to a dosing unit which may be on a separate platform. The dosing unit in one embodiment comprises a pressurized flow line.
(FR) L'invention concerne un système dans lequel un faible flux de solution de dépôt est dévié d'un grand flux de solution de dépôt s'écoulant sur une plate-forme d'outil de dépôt électrochimique. Ce faible flux est dévié vers une unité de dosage pouvant se situer sur une plate-forme séparée. Dans un mode de réalisation, cette unité de dosage comprend une ligne d'écoulement sous pression.
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