WO2002001609 CLEANING METHOD AND SOLUTION FOR CLEANING A WAFER IN A SINGLE WAFER PROCESS

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Publication Number WO/2002/001609

Publication Date 03.01.2002

International Application No. PCT/US2001/041160

International Filing Date 26.06.2001

Chapter 2 Demand Filed 25.01.2002

IPC

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CPC

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Applicants

APPLIED MATERIALS, INC. [US]/[US]

Inventors

VERHAVERBEKE, Steven
TRUMAN, J., Kelly

Agents

BERNADICOU, Michael, A.

Priority Data

09/891,730		25.06.2001		US
60/214,116		26.06.2000		US

Publication Language English (en)

Filing Language English (EN)

Designated States

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Title

(EN) CLEANING METHOD AND SOLUTION FOR CLEANING A WAFER IN A SINGLE WAFER PROCESS

(FR) PROCEDE DE NETTOYAGE ET SOLUTION DE NETTOYAGE DE PLAQUETTE EN PROCESSUS DE NETTOYAGE DE PLAQUETTE UNIQUE

Abstract

(EN) The present invention is a novel cleaning method and a solution for use in a single wafer cleaning process. According to the present invention the cleaning solution comprises ammonium hydroxide (NH₄OH), hydrogen peroxide (H₂O₂), water (H₂O) and a chelating agent. In an embodiment of the present invention the cleaning solution also contains a surfactant. And still yet another embodiment of the present invention the cleaning solution also comprises a dissolved gas such as H₂. In a particular embodiment of the present invention, this solution is used by spraying or dispensing it on a spinning wafer.

(FR) L'invention concerne un procédé de nettoyage et une solution pour processus de nettoyage de plaquette unique. La solution comprend de l'hydroxyde d'ammonium (NH₄OH), du peroxyde d'hydrogène (H₂O₂), de l'eau (H₂O) et un chélateur. Selon une variante, la solution comprend aussi un tensioactif. Selon une autre variante, la solution comprend également un gaz dissous du type H₂. En mode de réalisation particulier, l'invention est vaporisée ou distribuée sur une plaquette qui tournoie.

C	CHEMISTRY; METALLURGY
11	ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
D	DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
1	Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
02	Anionic compounds
12	Sulfonic acids or sulfuric acid esters; Salts thereof
29	Sulfates of polyoxyalkylene ethers

C	CHEMISTRY; METALLURGY
11	ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
D	DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
1	Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
66	Non-ionic compounds
72	Ethers of polyoxyalkylene glycols

C	CHEMISTRY; METALLURGY
11	ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
D	DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
3	Other compounding ingredients of detergent compositions covered in group C11D1/101
02	Inorganic compounds

C	CHEMISTRY; METALLURGY
11	ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
D	DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
3	Other compounding ingredients of detergent compositions covered in group C11D1/101
16	Organic compounds
26	containing nitrogen
32	Amides; Substituted amides

C	CHEMISTRY; METALLURGY
11	ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
D	DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
3	Other compounding ingredients of detergent compositions covered in group C11D1/101
16	Organic compounds
26	containing nitrogen
33	Amino carboxylic acids

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1. WO2002001609 - CLEANING METHOD AND SOLUTION FOR CLEANING A WAFER IN A SINGLE WAFER PROCESS

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21	Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

B	PERFORMING OPERATIONS; TRANSPORTING
08	CLEANING
B	CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
3	Cleaning by methods involving the use or presence of liquid or steam
04	Cleaning involving contact with liquid
08	the liquid having chemical or dissolving effect

C	CHEMISTRY; METALLURGY
11	ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
D	DETERGENT COMPOSITIONS
1	Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
02	Anionic compounds
12	Sulfonic acids or sulfuric acid esters; Salts thereof
29	Sulfates of polyoxyalkylene ethers

C	CHEMISTRY; METALLURGY
23	COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
G	CLEANING OR DEGREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
5	Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents

Y	SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10	TECHNICAL SUBJECTS COVERED BY FORMER USPC
S	TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
261	Gas and liquid contact apparatus
07	Carbonators

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21	Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02	Manufacture or treatment of semiconductor devices or of parts thereof
04	the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18	the devices having semiconductor bodies comprising elements of group IV of the Periodic System or A_IIIB_V compounds with or without impurities, e.g. doping materials
30	Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302	to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
306	Chemical or electrical treatment, e.g. electrolytic etching