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1. (WO2002000961) METHOD FOR PRODUCING A MULTI-FUNCTIONAL, MULTI-PLY LAYER ON A TRANSPARENT PLASTIC SUBSTRATE AND A MULTI-FUNCTIONAL MULTI-PLY LAYER PRODUCED ACCORDING TO SAID METHOD

Pub. No.:    WO/2002/000961    International Application No.:    PCT/DE2001/002380
Publication Date: Jan 3, 2002 International Filing Date: Jun 26, 2001
IPC: C23C 14/08
C23C 14/20
C23C 14/35
C23C 16/30
Applicants: ROTH & RAU OBERFLÄCHENTECHNIK AG
DITTRICH, Karl-Heinz
ROTH, Dietmar
Inventors: DITTRICH, Karl-Heinz
ROTH, Dietmar
Title: METHOD FOR PRODUCING A MULTI-FUNCTIONAL, MULTI-PLY LAYER ON A TRANSPARENT PLASTIC SUBSTRATE AND A MULTI-FUNCTIONAL MULTI-PLY LAYER PRODUCED ACCORDING TO SAID METHOD
Abstract:
The invention relates to a method for producing a multi-functional, multi-ply layer on a transparent plastic substrate and to a multi-functional, multi-ply layer produced according to said method. According to said method, a plasma is created on a transparent plastic substrate (1) in a plasma-assisted, closed cycle operation, using a microwave plasma source and said plasma is constantly maintained during the course of said operation. A first adhesion-promoting organosilicon polymer layer (2) is deposited in the microwave plasma, followed by a first ITO layer (3), then a transparent metal and/or metal oxide layer and subsequently a second ITO layer (3), using cathode sputtering. Finally, an organosilicon polymer layer (5) is deposited. The multi-functional multi-ply layer consists of a first adhesion-promoting organosilicon polymer layer (2) with a thickness of between 50 and 300 nm, a first ITO layer (3) with a thickness of between 50 and 300 nm, at least one transparent metal and/or metal oxide layer with a thickness of between 10 and 30 nm, a second ITO layer (3) with a thickness of between 50 and 300 nm and at least one final organosilicon polymer layer (5) with a thickness of between 300 and 6000 nm.