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Machine translation
1. (WO2001089756) LASER DRILLING METHOD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2001/089756    International Application No.:    PCT/JP2000/003285
Publication Date: 29.11.2001 International Filing Date: 23.05.2000
Chapter 2 Demand Filed:    29.11.2001    
IPC:
B23K 26/067 (2006.01), B23K 26/40 (2006.01), H05K 3/00 (2006.01)
Applicants: SUMITOMO HEAVY INDUSTRIES, LTD. [JP/JP]; 9-11, Kitashinagawa 5-chome, Shinagawa-ku, Tokyo 141-8686 (JP) (For All Designated States Except US).
KUWABARA, Takashi [JP/JP]; (JP) (For US Only)
Inventors: KUWABARA, Takashi; (JP)
Agent: GOTO, Yosuke; The Third Mori Building, 4-10, Nishishinbashi 1-chome, Minato-ku, Tokyo 105-0003 (JP)
Priority Data:
Title (EN) LASER DRILLING METHOD
(FR) PROCEDE DE PERÇAGE PAR LASER
Abstract: front page image
(EN)An ultraviolet laser beam with a pulse width of 100-300 (nsec) is applied to a resin layer of a printed circuit board to make a hole.
(FR)L'invention concerne un faisceau laser ultraviolet doté d'une largeur d'impulsion comprise entre 100 et 300 (nsec) que l'on applique à une couche de résine d'une carte de circuit imprimé pour faire un trou.
Designated States: CN, JP, KR, NO, US.
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)