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1. (WO2001089084) SAW DEVICE AND METHOD OF MANUFACTURE THEREOF
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2001/089084    International Application No.:    PCT/JP2001/003864
Publication Date: 22.11.2001 International Filing Date: 09.05.2001
IPC:
H03H 3/08 (2006.01), H03H 9/05 (2006.01), H03H 9/10 (2006.01)
Applicants: KABUSHIKI KAISHA TOSHIBA [JP/JP]; 1-1, Shibaura 1-chome Minato-ku, Tokyo 105-8001 (JP) (For All Designated States Except US).
CHUJO, Rieko [JP/JP]; (JP) (For US Only)
Inventors: CHUJO, Rieko; (JP)
Agent: SUZUYE, Takehiko; c/o SUZUYE & SUZUYE 7-2, Kasumigaseki 3-chome Chiyoda-ku, Tokyo 100-0013 (JP)
Priority Data:
2000-138098 11.05.2000 JP
Title (EN) SAW DEVICE AND METHOD OF MANUFACTURE THEREOF
(FR) DISPOSITIF A ONDES DE SURFACE ET SON PROCEDE DE FABRICATION
Abstract: front page image
(EN)A small multichip package is provided which includes a plurality of SAW elements of different frequency characteristics in a single package. A plurality of SAW elements are bonded face down to a package so that a line along which the SAW elements are aligned may be substantially perpendicular to the direction in which ultrasonic waves are applied.
(FR)L'invention concerne un boîtier multipuce de dimension réduite comprenant une pluralité d'éléments à ondes de surface (SAW) présentant différentes caractéristiques de fréquences, réunis dans un même boîtier. Ces éléments à onde de surface sont fixés en position retournée dans boîtier, de sorte que la ligne d'alignement de ces éléments à ondes de surface est sensiblement perpendiculaire à la direction d'application des ondes ultrasoniques.
Designated States: CN, JP, KR, US.
European Patent Office (DE, FR, GB).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)