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1. (WO2001088962) PLASMA ETCHING EQUIPMENT

Pub. No.:    WO/2001/088962    International Application No.:    PCT/DE2001/001778
Publication Date: Nov 22, 2001 International Filing Date: May 10, 2001
IPC: H01J 37/32
H01L 21/00
Applicants: ROBERT BOSCH GMBH
LAERMER, Franz
SCHILP, Andrea
Inventors: LAERMER, Franz
SCHILP, Andrea
Title: PLASMA ETCHING EQUIPMENT
Abstract:
The invention relates to a plasma etching equipment (5) for etching, especially anisotropic etching, of a substrate (11) through the action of a plasma. For that purpose, the inventive plasma etching equipment (5) comprises a first plasma generator (21), such as an inductive plasma generator, having first means (14) for generating a high-frequency electromagnetic alternative field, and a first plasma generating area (18) for generating a first plasma and a first gas supply (19). The equipment (5) also comprises a second plasma generator (20) such as an inductive plasma generator located upstream from the first plasma generator and comprising second means (15) for generating a second high-frequency electromagnetic alternative field, and a second plasma generating area (17) for generating a second plasma and a second gas supply (16). The substrate (1) to be etched is placed in the first plasma generator (21). In addition, the second plasma can be directed at least partially to the first plasma generator (21) as a first reactive gas through the first gas supply (19).