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1. (WO2001084895) SYSTEM FOR MOUNTING ELECTRONIC DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2001/084895    International Application No.:    PCT/JP2001/003654
Publication Date: 08.11.2001 International Filing Date: 26.04.2001
IPC:
H05K 3/12 (2006.01), H05K 13/04 (2006.01)
Applicants: SONY CORPORATION [JP/JP]; 7-35, Kitashinagawa 6-chome Shinagawa-ku, Tokyo 141-0001 (JP) (For All Designated States Except US).
MOCHIDA, Kazuhisa [JP/JP]; (JP) (For US Only).
TOGASAKI, Katsumi [JP/JP]; (JP) (For US Only).
MORITA, Katsumi [JP/JP]; (JP) (For US Only).
MASUTANI, Yusuke [JP/JP]; (JP) (For US Only).
KAMEDA, Hiroji [JP/JP]; (JP) (For US Only).
SEKIGUCHI, Noboru [JP/JP]; (JP) (For US Only).
SHIMADA, Minoru [JP/JP]; (JP) (For US Only).
TOYAMA, Toshio [JP/JP]; (JP) (For US Only).
KOGA, Akihiro [JP/JP]; (JP) (For US Only).
INOUE, Mitsuo [JP/JP]; (JP) (For US Only).
ABE, Kazuhiro [JP/JP]; (JP) (For US Only).
YONEMOTO, Tetsuya [JP/JP]; (JP) (For US Only).
ISHIHARA, Kenji [JP/JP]; (JP) (For US Only).
AOKI, Syunji [JP/JP]; (JP) (For US Only).
MATSUMOTO, Fumio [JP/JP]; (JP) (For US Only).
ARAI, Takanori [JP/JP]; (JP) (For US Only).
NAOSHIMA, Hisashi [JP/JP]; (JP) (For US Only)
Inventors: MOCHIDA, Kazuhisa; (JP).
TOGASAKI, Katsumi; (JP).
MORITA, Katsumi; (JP).
MASUTANI, Yusuke; (JP).
KAMEDA, Hiroji; (JP).
SEKIGUCHI, Noboru; (JP).
SHIMADA, Minoru; (JP).
TOYAMA, Toshio; (JP).
KOGA, Akihiro; (JP).
INOUE, Mitsuo; (JP).
ABE, Kazuhiro; (JP).
YONEMOTO, Tetsuya; (JP).
ISHIHARA, Kenji; (JP).
AOKI, Syunji; (JP).
MATSUMOTO, Fumio; (JP).
ARAI, Takanori; (JP).
NAOSHIMA, Hisashi; (JP)
Agent: KOIKE, Akira; No.11 Mori Bldg., 6-4, Toranomon 2-chome Minato-ku, Tokyo 105-0001 (JP)
Priority Data:
2000-132923 27.04.2000 JP
Title (EN) SYSTEM FOR MOUNTING ELECTRONIC DEVICE
(FR) SYSTEME POUR LE MONTAGE DE DISPOSITIFS ELECTRONIQUES
Abstract: front page image
(EN)A system (1) for mounting electronic devices comprises a printing device (3), a mounting device (4) and a reflow device (5). In the mounting system (1), a printed-circuit board (2) is conveyed upright. Solder is applied by printing to lands on both sides of the board (2) simultaneously, and electronic devices (10) are soldered to the lands. The mounting system (1) is small and capable of reducing mounting time.
(FR)Cette invention se rapporte à un système (1) pour le montage de dispositifs électroniques, qui comprend un dispositif d'impression (3), un dispositif de montage (4) et un dispositif de fusion (5). Dans le dispositif de montage (1), une carte à circuit imprimé (2) est acheminée en position verticale. Une soudure est appliquée par impression sur les pastilles des deux côtés de la carte (2) simultanément, et des dispositifs électroniques (10) sont soudés à ces pastilles. Ce système de montage (1) est de petite dimension et il permet de réduire le temps de montage.
Designated States: CN, IN, KR, US, VN.
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)