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Machine translation
1. (WO2001082340) METHOD AND DEVICE FOR TREATING A SUBSTRATE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2001/082340    International Application No.:    PCT/FR2001/001204
Publication Date: 01.11.2001 International Filing Date: 19.04.2001
IPC:
H01L 21/00 (2006.01)
Applicants: KARL SUSS FRANCE [FR/FR]; Avenue des Colombières F-74490 Saint Jeoire en Faucigny (FR) (For All Designated States Except US).
CAVAZZA, Gilbert [FR/FR]; (FR) (For US Only)
Inventors: CAVAZZA, Gilbert; (FR)
Agent: BONNETAT, Christian; Cabinet Bonnetat 29, rue de Saint Pétersbourg F-75008 Paris (FR)
Priority Data:
00/05087 20.04.2000 FR
Title (EN) METHOD AND DEVICE FOR TREATING A SUBSTRATE
(FR) PROCEDE ET DISPOSITIF POUR LE TRAITEMENT D'UN SUBSTRAT
Abstract: front page image
(EN)The invention concerns a method and a device for treating a substrate of an integrated circuit or the like during production. The invention is characterised in that it consists in spraying, from the bottom upwards, a treatment liquid (24) on the surface to be treated (20I), facing downwards, of said substrate (20) and transducers (8) apply ultrasonic waves to said substrate (20) via said spayed treatment liquid (24).
(FR)Procédé et dispositif pour le traitement du substrat d'un circuit intégré ou d'un produit analogue en cours de fabrication. Selon l'invention, on pulvérise, de bas en haut, un liquide de traitement (24) sur la face à traiter (20I), dirigée vers le bas, dudit substrat (20) et des transducteurs (8) appliquent des ondes ultrasonores audit substrat (20) par l'intermédiaire dudit liquide de traitement pulvérisé (24).
Designated States: JP, US.
Publication Language: French (FR)
Filing Language: French (FR)