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1. (WO2001081466) CURABLE RESIN COMPOSITION, CURED FILM, AND COMPOSITE PRODUCT
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2001/081466    International Application No.:    PCT/NL2001/000304
Publication Date: 01.11.2001 International Filing Date: 17.04.2001
Chapter 2 Demand Filed:    13.09.2001    
IPC:
C08F 283/12 (2006.01), C08F 290/06 (2006.01), C08L 51/08 (2006.01), C08L 51/10 (2006.01), C09D 151/08 (2006.01), C09D 151/10 (2006.01)
Applicants: DSM N.V. [NL/NL]; Het Overloon 1 NL-6411 TE Heerlen (NL) (For All Designated States Except US).
JSR CORPORATION [JP/JP]; JSR Building 2-11-24, Tsukiji Chuo-ku Tokyo 104-8410 (JP) (For All Designated States Except US).
JAPAN FINE COATINGS CO., LTD. [JP/JP]; 2-11-24, Tsukiji Chuo-ku Tokyo 104-8410 (JP) (For All Designated States Except US).
YAMAGUCHI, Yoshikazu [JP/JP]; (JP) (For US Only).
NISHIWAKI, Isao [JP/JP]; (JP) (For US Only).
ERIYAMA, Yuichi [JP/JP]; (JP) (For US Only).
UKACHI, Takashi [JP/JP]; (JP) (For US Only).
YASHIRO, Takao [JP/JP]; (JP) (For US Only).
TAKAHASHI, Michiko [JP/JP]; (JP) (For US Only)
Inventors: YAMAGUCHI, Yoshikazu; (JP).
NISHIWAKI, Isao; (JP).
ERIYAMA, Yuichi; (JP).
UKACHI, Takashi; (JP).
YASHIRO, Takao; (JP).
TAKAHASHI, Michiko; (JP)
Agent: RENKEMA, Jacob; DSM Patents & Trademarks P.O. Box 9 NL-6160 MA Geleen (NL)
Priority Data:
2000-120102 20.04.2000 JP
2000-120099 20.04.2000 JP
2000-129060 28.04.2000 JP
2000-171831 08.06.2000 JP
2000-310522 11.10.2000 JP
Title (EN) CURABLE RESIN COMPOSITION, CURED FILM, AND COMPOSITE PRODUCT
(FR) COMPOSITION DE RESINE DURCISSABLE, FILM DURCI ET PRODUIT COMPOSITE
Abstract: front page image
(EN)A curable resin composition comprising (A) reactive particles prepared by bonding (A1) at least one of oxide particles of an element selected from the group consisting of silicon, aluminum, zirconium, titanium, zinc, germanium, indium, tin, antimony, ruthenium, rhenium, silver, nickel, cupper and cerium, and (A2) an organic compound which comprises a polymerizable unsaturated group, (B) a compound having two or more polymerizable unsaturated groups in the molecule, and optionally (C) a terminal reactive polysiloxane compound having at least one polymerizable group, other than organic compound (A2).
(FR)L'invention concerne une composition de résine durcissable contenant (A) des particules réactives préparées par liaison (A1) d'au moins une particule d'oxyde d'un élément choisi dans le groupe constitué par le silicium, l'aluminium, le zirconium, le titane, le zinc, le germanium, l'indium, l'étain, l'antimoine, le ruthénium, le rhénium, l'argent, le nickel, le cuivre et le cérium, et (A2) d'un composé organique comprenant un groupe non saturé polymérisable, (B) un composé renfermant au moins deux groupes non saturés polymérisables dans la molécule, et éventuellement (C) un composé polysiloxane réactif terminal autre que le composé organique (A2) comprenant au moins un groupe polymérisable.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, TZ, UA, UG, US, UZ, VN, YU, ZA, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)