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1. WO2001060138 - MULTI-DEVICE HEAT SINK ASSEMBLY

Publication Number WO/2001/060138
Publication Date 16.08.2001
International Application No. PCT/US2001/002244
International Filing Date 24.01.2001
Chapter 2 Demand Filed 29.08.2001
IPC
H01L 23/40 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
40Mountings or securing means for detachable cooling or heating arrangements
CPC
H01L 2023/4037
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
40Mountings or securing means for detachable cooling or heating arrangements
4006with bolts or screws
4037characterised by thermal path or place of attachment of heatsink
H01L 2023/4056
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
40Mountings or securing means for detachable cooling or heating arrangements
4006with bolts or screws
4037characterised by thermal path or place of attachment of heatsink
4056heatsink to additional heatsink
H01L 2023/4068
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
40Mountings or securing means for detachable cooling or heating arrangements
4006with bolts or screws
4037characterised by thermal path or place of attachment of heatsink
4068Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
H01L 23/4006
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
40Mountings or securing means for detachable cooling or heating arrangements
4006with bolts or screws
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applicants
  • TYCO ELECTRONICS LOGISTICS AG [CH]/[CH]
Inventors
  • RIFE, William, B.
Agents
  • JOSEPHS, David, R.
Priority Data
09/535,77528.03.2000US
60/181,39409.02.2000US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) MULTI-DEVICE HEAT SINK ASSEMBLY
(FR) ENSEMBLE PUITS DE CHALEUR PERMETTANT D'ELIMINER LA CHALEUR DE PLUSIEURS DISPOSITIFS
Abstract
(EN)
A heat sink assembly (10) for removing heat from multiple semiconductor devices (12, 14) is disclosed. A support plate (20) is positioned over the semiconductor devices (12, 14) to be cooled. Two threaded bores (22, 24) corresponding to the positioning and layout of the semiconductor devices (12, 14). The support plate (20) is secured relative to the semiconductor devices (12, 14). Heat dissipating members (26, 32) are threadably received in the bores (22, 24) to dissipate heat from the semiconductor devices (12, 14) simultaneously using a single, small footprint, heat sink assembly (10).
(FR)
L'invention concerne un ensemble puits de chaleur (10) permettant d'éliminer la chaleur provenant de plusieurs dispositifs à semi-conducteurs (12, 14). Une plaque de support (20) positionnée sur les dispositifs à semi-conducteurs (12, 14) de façon à être refroidie, comprend deux alésages filetés (22, 24) correspondant au positionnement et à l'implantation desdits dispositifs à semi-conducteurs (12, 14), ladite plaque de support (20) étant fixée sur ces dispositifs à semi-conducteurs (12, 14). Des éléments de dissipation (26, 32) de chaleur s'engagent par filetage dans les alésages (22, 24), de façon à dissiper la chaleur provenant simultanément des dispositifs à semi-conducteurs (12, 14) à l'aide d'un seul ensemble puits de chaleur (10) peu encombrant.
Also published as
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