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1. WO2001059827 - ENCAPSULATION FOR AN ELECTRICAL COMPONENT AND METHOD FOR PRODUCING THE SAME

Publication Number WO/2001/059827
Publication Date 16.08.2001
International Application No. PCT/DE2001/000404
International Filing Date 02.02.2001
Chapter 2 Demand Filed 22.08.2001
IPC
H01L 21/50 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
H03H 9/10 2006.1
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
02Details
05Holders or supports
10Mounting in enclosures
CPC
H01L 21/50
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
H01L 21/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
56Encapsulations, e.g. encapsulation layers, coatings
H01L 2924/16235
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
15Details of package parts other than the semiconductor or other solid state devices to be connected
161Cap
162Disposition
16235Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
H03H 9/1071
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
02Details
05Holders; Supports
10Mounting in enclosures
1064for surface acoustic wave [SAW] devices
1071the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
Applicants
  • EPCOS AG [DE]/[DE] (AllExceptUS)
  • PAHL, Wolfgang [DE]/[DE] (UsOnly)
  • FISCHER, Walter [DE]/[DE] (UsOnly)
Inventors
  • PAHL, Wolfgang
  • FISCHER, Walter
Agents
  • EPPING HERMANN & FISCHER GBR
Priority Data
100 06 446.914.02.2000DE
Publication Language German (de)
Filing Language German (DE)
Designated States
Title
(DE) VERKAPSELUNG FÜR EIN ELEKTRISCHES BAUELEMENT UND VERFAHREN ZUR HERSTELLUNG
(EN) ENCAPSULATION FOR AN ELECTRICAL COMPONENT AND METHOD FOR PRODUCING THE SAME
(FR) ENCAPSULAGE D'UN COMPOSANT ELECTRIQUE ET SON PROCEDE DE PRODUCTION
Abstract
(DE) Zur Verkapselung empfindlicher Bauelementstrukturen (2) wird vorgeschlagen, die Bauelementstrukturen mit einer Rahmenstruktur (6) aus einem lichtempfindlichen Reaktionsharz zu umschließen und dieses nach Aufbringen einer Hilfsfolie (7) mit einer weiteren strukturierten Reaktionsharzschicht (8) abzudecken. Zum Beispiel durch strukturiertes Aufdrucken oder durch Photostrukturierung können über den Rahmenstrukturen (6) passende Dachstrukturen (10) herausgebildet werden. Die Reste der frei liegenden Hilfsfolie werden herausgelöst oder heraus geätzt.
(EN) Sensitive component structures (2) can be encapsulated by enclosing them with a frame structure (6) consisting of a light-sensitive reaction resin and covering the latter with another, structured layer of reaction resin after applying an auxiliary film (7). Top structures (10) which fit over the frame structures (6) can be produced e.g., by structured imprinting or photostructuring. The residual parts of the exposed auxiliary film are removed by dissolving or etching.
(FR) Pour encapsuler des structures composants sensibles (2), on les enveloppe dans une structure cadre (6) en résine de réaction photosensible que l'on recouvre d'une autre couche de résine de réaction (8) après application d'un film auxiliaire (7). Sur les structures cadres (6), on peut former des structures supérieures (10) adaptées, par exemple, par impression structurée ou photostructuration. Les restes du film auxiliaire découvert sont enlevés par dissolution ou attaque chimique.
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