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1. WO2001058225 - COPPER FOIL EXCELLENT IN LASER BEAM DRILLING PERFORMANCE AND PRODUCTION METHOD THEREFOR

Publication Number WO/2001/058225
Publication Date 09.08.2001
International Application No. PCT/JP2000/008578
International Filing Date 04.12.2000
Chapter 2 Demand Filed 20.04.2001
IPC
B23K 26/18 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
18using absorbing layers on the workpiece, e.g. for marking or protecting purposes
B23K 26/38 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
38by boring or cutting
H05K 3/00 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
H05K 3/38 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
38Improvement of the adhesion between the insulating substrate and the metal
CPC
B23K 2101/35
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2101Articles made by soldering, welding or cutting
34Coated articles ; , e.g. plated or painted; Surface treated articles
35Surface treated articles
B23K 2103/08
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2103Materials to be soldered, welded or cut
08Non-ferrous metals or alloys
B23K 2103/12
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2103Materials to be soldered, welded or cut
08Non-ferrous metals or alloys
12Copper or alloys thereof
B23K 26/18
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
18using absorbing layers on the workpiece, e.g. for marking or protecting purposes
B23K 26/382
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
38by boring or cutting
382by boring
B23K 26/40
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
40taking account of the properties of the material involved
Applicants
  • NIKKO MATERIALS COMPANY, LIMITED [JP]/[JP] (AllExceptUS)
  • KITANO, Kouji [JP]/[JP] (UsOnly)
  • HANAFUSA, Mikio [JP]/[JP] (UsOnly)
Inventors
  • KITANO, Kouji
  • HANAFUSA, Mikio
Agents
  • OGOSHI, Isamu
Priority Data
2000-2617403.02.2000JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) COPPER FOIL EXCELLENT IN LASER BEAM DRILLING PERFORMANCE AND PRODUCTION METHOD THEREFOR
(FR) FEUILLARD DE CUIVRE PRESENTANT DES CAPACITES EXCELLENTES DE PERÇAGE AU FAISCEAU LASER ET SON PROCEDE DE PRODUCTION
Abstract
(EN)
A copper foil excellent in laser beam drilling performance, which comprises a layer formed on a laser beam irradiation surface and containing at least any one kind of material out of indium, tin, cobalt, zinc, cobalt alloy and nickel alloy, and which is easy to laser-machine and suitable for forming a small-diameter, interlayer connection hole by means of an improvement in copper foil surface during a printed circuit board production; and a production method therefor.
(FR)
Feuillard de cuivre possédant d'excellentes capacités de perçage au faisceau laser, comprenant une couche créée sur une surface d'irradiation au laser et contenant au moins un des matériaux sélectionnés dans indium, étain, cobalt, zinc, alliage de cobalt et alliage de nickel. Ce feuillard est facile à usiner au laser et approprié pour creuser un trou d'interconnexion de petit diamètre au moyen d'une amélioration apportée à la surface de ce feuillard pendant la fabrication d'une carte de circuit imprimé. Procédé servant à produire ce feuillard.
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