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1. WO2001057937 - CONCENTRICALLY LEADED POWER SEMICONDUCTOR DEVICE PACKAGE

Publication Number WO/2001/057937
Publication Date 09.08.2001
International Application No. PCT/US2001/003270
International Filing Date 31.01.2001
IPC
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
075
the devices being of a type provided for in group H01L33/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
62
Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
64
Heat extraction or cooling elements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
S
DEVICES USING STIMULATED EMISSION
5
Semiconductor lasers
02
Structural details or components not essential to laser action
022
Mountings; Housings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
S
DEVICES USING STIMULATED EMISSION
5
Semiconductor lasers
02
Structural details or components not essential to laser action
024
Cooling arrangements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
S
DEVICES USING STIMULATED EMISSION
5
Semiconductor lasers
40
Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02-H01S5/30128
H01L 23/48 (2006.01)
H01L 25/075 (2006.01)
H01L 33/62 (2010.01)
H01L 33/64 (2010.01)
H01S 5/022 (2006.01)
H01S 5/024 (2006.01)
CPC
H01L 2224/48091
H01L 25/0753
H01L 2924/01057
H01L 2924/01078
H01L 2924/01079
H01L 2924/12041
Applicants
  • LUMILEDS LIGHTING, U.S., LLC [US/US]; 370 W. Trimble Road MS 91UK San Jose, CA 95131, US
Inventors
  • LOH, Ban Poh; US
  • WOOLVERTON, Douglas, P.; US
  • SNYDER, Wayne, L.; US
Agents
  • LEITERMAN, Rachel, V. ; SKJERVEN MORRILL MACPHERSON LLP 25 Metro Drive, Suite 700 San Jose, CA 95110, US
Priority Data
09/498,31104.02.2000US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) CONCENTRICALLY LEADED POWER SEMICONDUCTOR DEVICE PACKAGE
(FR) BOITIER SEMI-CONDUCTEUR HAUTE INTENSITE A PATTES CONCENTRIQUES
Abstract
(EN)
A concentrically leaded power semiconductor package includes two or more generally concentric conductors. An inner conductor may provide an attachment point for one or more semiconductor devices at an end of the inner conductor and an electrical connection at an opposite end. An outer conductor may be pressed onto the inner conductor and may be separated by an electrical insulator. A semiconductor device, such as a light emitting diode (LED), may be attached to the inner conductor by epoxy gluing or by soldering, and may be attached to the outer conductor by a bonding wire. The package may be cylindrical or a rectangular solid. The package may incorporate additional semiconductor mounting surfaces and more than two conductors.
(FR)
L'invention concerne un boîtier semi-conducteur haute intensité à pattes concentriques comprenant généralement deux ou plusieurs conducteurs concentriques. Un conducteur intérieur peut fournir un point de fixation pour un ou plusieurs dispositifs à semi-conducteurs à une extrémité du conducteur intérieur et une connexion électrique à l'extrémité opposée. Un conducteur extérieur peut être pressé contre le conducteur intérieur et séparé par un isolateur électrique. Un dispositif à semi-conducteurs, tel qu'une diode électroluminescente (DEL), peut être fixée au conducteur intérieur par collage à l'époxyde ou par soudage, et peut être fixée au conducteur extérieur au moyen d'un fil de connexion. Le boîtier peut être cylindrique ou un solide de forme rectangle. Il peut comprendre des surfaces de montage de semi-conducteur supplémentaires et plus de deux conducteurs.
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