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1. WO2001056339 - FLEXIBLE PRINTED WIRING BOARD AND ITS PRODUCTION METHOD

Publication Number WO/2001/056339
Publication Date 02.08.2001
International Application No. PCT/JP2000/000344
International Filing Date 25.01.2000
IPC
H05K 3/30 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
H05K 3/32 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
H05K 3/40 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
H05K 3/42 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
42Plated through-holes
CPC
H05K 2201/0154
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
01Dielectrics
0137Materials
0154Polyimide
H05K 2201/0347
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
03Conductive materials
0332Structure of the conductor
0335Layered conductors or foils
0347Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
H05K 2201/0355
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
03Conductive materials
0332Structure of the conductor
0335Layered conductors or foils
0355Metal foils
H05K 2201/0367
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
03Conductive materials
0332Structure of the conductor
0364Conductor shape
0367Metallic bump or raised conductor not used as solder bump
H05K 2201/0394
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
03Conductive materials
0332Structure of the conductor
0388Other aspects of conductors
0394Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
H05K 2201/09481
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09209Shape and layout details of conductors
09372Pads and lands
09481Via in pad; Pad over filled via
Applicants
  • SONY CHEMICALS CORP. [JP]/[JP] (AllExceptUS)
  • KURITA, Hideyuki [JP]/[JP] (UsOnly)
  • TANIGUCHI, Masato [JP]/[JP] (UsOnly)
Inventors
  • KURITA, Hideyuki
  • TANIGUCHI, Masato
Agents
  • TAJIME, Noboru
Priority Data
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) FLEXIBLE PRINTED WIRING BOARD AND ITS PRODUCTION METHOD
(FR) CARTE DE CIRCUITS IMPRIMES FLEXIBLE ET SON PROCEDE DE PRODUCTION
Abstract
(EN) A flexible printed wiring board (10) in which a metallic bump (1a) of a first flexible printed wiring part (1) is connected to a connection pad (2a) of a second flexible wiring part (2), wherein the first flexible printed wiring part (1) is composed of a conductive layer (4) and an insulating layer (5) adjacent to the conductive layer (4), a hole (A) reaching the conductive layer is made in the insulating layer (5), a metallic plug (6) is formed in the hole (A) by electroplating, and the end of the metallic plug (6) projecting from the insulating layer (5) serves as a metallic bump (1a). As many flexible printed wiring boards as possible are produced from a laminated sheet for a flexible printed wiring having a predetermined size.
(FR) La présente invention concerne une carte de circuits imprimés (10) flexible dans laquelle une bosse métallique (1a) d'une première partie (1) de la carte de circuits imprimés flexible est reliée à une plage de connexion (2a) d'une seconde partie (2) de la carte de circuits imprimés, ladite première partie (1) de la carte de circuit imprimés flexible étant composée d'une couche conductrice (4) et d'une couche isolante (5) adjacente à la couche conductrice (4). Un trou (A) atteignant la couche isolante est pratiqué dans la couche isolante (5). Un bouchon métallique (6) est formé dans le trou (A) par électroplacage, l'extrémité du bouchon métallique dépassant de la couche isolante(5) sert de bosse métallique (1a). En outre, on peut fabriquer une multitude de cartes de circuits imprimés flexibles à partir d'une feuille stratifiée pour un câblage de carte de circuits imprimés flexible de taille prédéterminé.
Related patent documents
SGSG2001056639This application is not viewable in PATENTSCOPE because the national phase entry has not been published yet or the national entry is issued from a country that does not share data with WIPO or there is a formatting issue or an unavailability of the application.
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