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1. WO2001055790 - PHOTOCURABLE RESIN COMPOSITIONS

Publication Number WO/2001/055790
Publication Date 02.08.2001
International Application No. PCT/JP2001/000459
International Filing Date 24.01.2001
IPC
G03F 7/00 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
G03F 7/004 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
G03F 7/027 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
G03F 7/032 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
032with binders
G03F 7/033 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
032with binders
033the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
CPC
C08F 2/50
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
2Processes of polymerisation
46Polymerisation initiated by wave energy or particle radiation
48by ultra-violet or visible light
50with sensitising agents
C08F 290/067
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
290Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
02on to polymers modified by introduction of unsaturated end groups
06Polymers provided for in subclass C08G
067Polyurethanes; Polyureas
C08G 18/8116
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
18Polymeric products of isocyanates or isothiocyanates
06with compounds having active hydrogen
70characterised by the isocyanates or isothiocyanates used
81Unsaturated isocyanates or isothiocyanates
8108having only one isocyanate or isothiocyanate group
8116esters of acrylic or alkylacrylic acid having only one isocyanate or isothiocyanate group
C08G 63/21
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
63Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
02Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
12derived from polycarboxylic acids and polyhydroxy compounds
16Dicarboxylic acids and dihydroxy compounds
20Polyesters having been prepared in the presence of compounds having one reactive group or more than two reactive groups
21in the presence of unsaturated monocarboxylic acids or unsaturated monohydric alcohols or reactive derivatives thereof
G03F 7/0007
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
0005Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
0007Filters, e.g. additive colour filters; Components for display devices
G03F 7/0047
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
0047characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
Applicants
  • DAICEL CHEMICAL INDUSTRIES, LTD. [JP]/[JP] (AllExceptUS)
  • MIYAKE, Hiroto [JP]/[JP] (UsOnly)
  • MARUO, Katsuya [JP]/[JP] (UsOnly)
  • OKITSU, Kiyoshi [JP]/[JP] (UsOnly)
Inventors
  • MIYAKE, Hiroto
  • MARUO, Katsuya
  • OKITSU, Kiyoshi
Agents
  • MIURA, Yoshikazu
Priority Data
2000-11628818.04.2000JP
2000-1625525.01.2000JP
2000-35853724.11.2000JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) PHOTOCURABLE RESIN COMPOSITIONS
(FR) COMPOSITIONS DE RESINE PHOTODURCISSABLE
Abstract
(EN) A photocurable resin composition which comprises a resin having hydroxyl groups and polymerizable unsaturated groups, a photopolymerization initiator, and a photopolymerizable monomer; and a method of molding PDP ribs from the photocurable resin composition which further contains a diluting solvent. Also provided are: a liquid photoresist resin composition for printed circuit boards which is obtained by incorporating an organic solvent and/or a polymerizable vinyl monomer into a modified copolymer obtained through the addition reaction of an alicyclic epoxidized ethylenic compound with a carboxylated resin obtained by polymerizing a monomer ingredient comprising a carboxylated ethylenic compound as an essential monomer; and a photocurable resin composition comprising the photoresist resin composition and a composition of carboxyl-terminated monomers obtained by the modification with an acid anhydride of hydroxyl-terminated acrylates formed by causing 1 mol of a hydroxyalkyl (meth)acrylate to add 0.3 to less than 1 mol of $g(e)-caprolactone on the average.
(FR) L'invention concerne une composition de résine photodurcissable renfermant une résine possédant des groupes hydroxyle et des groupes polymérisables non saturés, un initiateur de photopolymérisation, et un monomère photopolymérisable, et un procédé de moulage de rainure PDP à partir de la composition de résine photodurcissable qui contient également un solvant de dilution. L'invention concerne en outre : une composition de résine photodurcissable liquide destinée à des circuits imprimés et obtenue par incorporation d'un solvant organique et/ou d'un monomère vinylique polymérisable dans un copolymère modifié obtenu par la réaction d'addition d'un composé éthylénique alicyclique époxydé avec une résine carboxylée obtenue par polymérisation d'un ingrédient monomère renfermant un composé éthylénique carboxylé en tant que monomère essentiel, ainsi qu'une composition de résine photodurcissable comprenant la composition de résine photodurcissable et une composition de monomères à terminaison carboxyle obtenus par modification, au moyen d'un anhydride d'acide, d'acrylates à terminaison hydroxyle formé par addition d'1 mole d'un méthacrylate d'hydroxyalkyle à en moyenne 0,3 à 1 mole au plus d'un $g(e)-caprolactone.
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