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1. WO2001045892 - METHOD AND DEVICE FOR TREATING LIGHTWEIGHT COMPONENTS

Publication Number WO/2001/045892
Publication Date 28.06.2001
International Application No. PCT/EP2000/012602
International Filing Date 12.12.2000
Chapter 2 Demand Filed 17.07.2001
IPC
B23K 26/02 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
B23K 26/32 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
20Bonding
32taking account of the properties of the material involved
B23K 26/40 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
40taking account of the properties of the material involved
CPC
B23K 2103/08
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2103Materials to be soldered, welded or cut
08Non-ferrous metals or alloys
B23K 2103/14
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2103Materials to be soldered, welded or cut
08Non-ferrous metals or alloys
14Titanium or alloys thereof
B23K 2103/50
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2103Materials to be soldered, welded or cut
50Inorganic material, e.g. metals, not provided for in B23K2103/02B23K2103/26
B23K 26/02
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
B23K 26/32
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
20Bonding
32taking account of the properties of the material involved
B23K 26/40
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
40taking account of the properties of the material involved
Applicants
  • PFALZ-FLUGZEUGWERKE GMBH [DE]/[DE] (AllExceptUS)
  • MORISSE, Lutz [DE]/[DE] (UsOnly)
  • SEFRIN, Christian [DE]/[DE] (UsOnly)
Inventors
  • MORISSE, Lutz
  • SEFRIN, Christian
Agents
  • ISENBRUCK, Günter
Priority Data
199 61 773.221.12.1999DE
Publication Language German (de)
Filing Language German (DE)
Designated States
Title
(DE) VERFAHREN UND VORRICHTUNG ZUR BEARBEITUNG VON LEICHTBAUTEILKOMPONENTEN
(EN) METHOD AND DEVICE FOR TREATING LIGHTWEIGHT COMPONENTS
(FR) PROCEDE ET DISPOSITIF POUR TRAVAILLER SUR DES COMPOSANTS LEGERS
Abstract
(DE) Die Erfindung bezieht sich auf ein Verfahren zum Bearbeiten von Leichtbauteilen, Titanlegierungen enthaltend, mit einem Laser (1), der im wesentlichen einer Bewegungsrichtung (2) relativ zu den bearbeitenden Leichtbauteilkomponenten (3, 50, 53, 55) bewegbar ist, mit nachfolgenden Verfahrensschritten: dem Positionieren von z bearbeitenden Leichtbauteilkomponenten (3, 50, 53, 55) auf Spanneinrichtungen (4, 19, 20, 26, 27), dem Antreiben der die Leichtbauteilkomponenten (3, 50, 53, 55) aufnehmenden Spannvorrichtungen (4, 19, 20, 26, 27) relativ zum Laserkopf (1) und dem Ausführen von Schneid- bzw. Fügevorgängen an den solcherart positionierten Leichtbauteilkomponenten (3, 50, 53, 55) durch einen Laserkopf (1).
(EN) The invention relates to a method for treating lightweight components that contain titanium alloys. A laser (1) can be moved essentially in relation to a moving direction towards the lightweight components (3, 50, 53, 55) to be treated. The inventive method comprises the following steps: lightweight components (3, 50, 53, 55) to be treated are positioned on clamping devices (4, 19, 20, 26, 27), the clamping devices (4, 19, 20, 26, 27) which receive the lightweight components (3, 50, 53, 55) are driven in relation to the laser head (1) and cutting or joining processes are carried out on the such positioned lightweight components (3, 50, 53, 55) by means of a laser head (1).
(FR) L'invention concerne un procédé pour travailler sur des composants légers qui contiennent des alliages de titane. Selon l'invention, on utilise un laser (1) qui peut être déplacé essentiellement dans un sens de déplacement (2), par rapport aux composants légers (3, 50, 53, 55) sur lesquels on veut travailler. Ce procédé comprend les étapes suivantes: positionnement des composants légers (3, 50, 53, 55) sur des dispositifs de serrage (4, 19, 20, 26, 27), déplacement, par rapport à la tête laser (1), des dispositifs de serrage (4, 19, 20, 26, 27) sur lesquels sont fixés les composants légers (3, 50, 53, 55), et réalisation, au moyen de la tête laser (1), de processus de coupe ou d'assemblage sur de tels composants légers (3, 50, 53, 55) ainsi positionnés.
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