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1. WO2001043202 - MOLDED IMAGE SENSOR PACKAGE HAVING LENS HOLDER

Publication Number WO/2001/043202
Publication Date 14.06.2001
International Application No. PCT/US2000/041468
International Filing Date 24.10.2000
IPC
H01L 31/0203 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02Details
0203Containers; Encapsulations
H01L 31/0232 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02Details
0232Optical elements or arrangements associated with the device
H04N 5/225 2006.1
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
222Studio circuitry; Studio devices; Studio equipment
225Television cameras
CPC
G02B 7/02
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
7Mountings, adjusting means, or light-tight connections, for optical elements
02for lenses
G02B 7/022
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
7Mountings, adjusting means, or light-tight connections, for optical elements
02for lenses
022lens and mount having complementary engagement means, e.g. screw/thread
H01L 2224/32013
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
31Structure, shape, material or disposition of the layer connectors after the connecting process
32of an individual layer connector
3201Structure
32012relative to the bonding area, e.g. bond pad
32013the layer connector being larger than the bonding area, e.g. bond pad
H01L 2224/32225
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
31Structure, shape, material or disposition of the layer connectors after the connecting process
32of an individual layer connector
321Disposition
32151the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
32221the body and the item being stacked
32225the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L 2224/48227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48225the item being non-metallic, e.g. insulating substrate with or without metallisation
48227connecting the wire to a bond pad of the item
H01L 2224/73265
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
732Location after the connecting process
73251on different surfaces
73265Layer and wire connectors
Applicants
  • AMKOR TECHNOLOGY, INC. [US]/[US]
Inventors
  • WEBSTER, Steven
Agents
  • HODGSON, Serge, J.
Priority Data
09/457,51308.12.1999US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) MOLDED IMAGE SENSOR PACKAGE HAVING LENS HOLDER
(FR) BOITIER DE CAPTEUR D'IMAGE MOULE DOTE D'UN SUPPORT POUR LENTILLE
Abstract
(EN) An image sensor package (1100) includes an image sensor (106), a window (122), and a molding (124C), where molding (124C) includes a lens holder extension portion (1102) extending upwards from window (122). Lens holder extension portion (1102) includes a female threaded aperture (1106) extending from window (122) such that window (122) is exposed through aperture (1106). A lens (1210) is supported in a threaded lens support (1112). Lens support (1112) is threaded into aperture (1106) of lens holder extension portion (1102). Lens (1210) is readily adjusted relative to image sensor (106) by rotating lens support (1112).
(FR) L'invention concerne un boîtier de capteur d'image (1100) comprenant un capteur d'image (106), une fenêtre (122), et un objet moulé (124C) comprenant une partie d'extension support pour lentille (1102) s'étendant vers le haut à partir de la fenêtre (122). La partie d'extension support pour lentille (1102) comprend une ouverture filetée femelle (1106) s'étendant à partir de la fenêtre (122), de sorte que cette fenêtre (122) soit exposée à travers l'ouverture (1106). Une lentille (1210) est portée par un support fileté pour lentille (1112). Ce support pour lentille (1112) est fileté dans l'ouverture (1106) de la partie d'extension support pour lentille (1102). La lentille (1210) est ajustée de façon adéquate par rapport au capteur d'image (106) par rotation du support pour lentille (1112).
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