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1. (WO2001039288) METHOD FOR PATTERNING DEVICES

Pub. No.:    WO/2001/039288    International Application No.:    PCT/US2000/031989
Publication Date: Fri Jun 01 01:59:59 CEST 2001 International Filing Date: Wed Nov 22 00:59:59 CET 2000
IPC: H01L 27/32
H01L 51/40
H01L 51/50
H01L 51/56
Applicants: THE TRUSTEES OF PRINCETON UNIVERSITY
Inventors: KIM, Changsoon
BURROWS, Paul, E.
FORREST, Stephen, R.
ZHOU, Theodore
Title: METHOD FOR PATTERNING DEVICES
Abstract:
The invention relates to patterning methods for organic devices, and more particularly to patterning methods using a die. A first layer of organic material (608) is deposited over a substrate (602), followed by a first electrode layer (608). A first patterned die (500) having a raised portion (506) is then pressed onto the first electrode layer (608), such that the raised portion (506) of the first patterned die (500) contacts portions of the first electrode layer (608). The patterned die (500) is removed, such that the portions of the first electrode layer (608) in contact with the raised portions (506) of the first patterned die (500) are removed. In one embodiment of the invention, a second organic layer is then deposited over the first electrode layer, followed by a second electrode layer. A second patterned die having a raised portion is pressed onto the second electrode layer, such that the raised portion of the second patterned die contacts portions of the second electrode layer. The second patterned die is removed, such that the portions of the second electrode layer in contact with the raised portions of the second patterned die are removed. Preferably the patterned die is coated with an adhesive material (508) such as a metal.