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1. (WO2001038597) METHOD FOR REGULATING SPUTTERING PROCESSES
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2001/038597 International Application No.: PCT/EP2000/010782
Publication Date: 31.05.2001 International Filing Date: 02.11.2000
Chapter 2 Demand Filed: 15.06.2001
IPC:
C23C 14/00 (2006.01) ,H01J 37/32 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
J
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37
Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32
Gas-filled discharge tubes
Applicants:
SZYSZKA, Bernd [DE/DE]; DE (UsOnly)
MALKOMES, Niels [DE/DE]; DE (UsOnly)
FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. [DE/DE]; Leonrodstrasse 54 80636 München, DE (AllExceptUS)
Inventors:
SZYSZKA, Bernd; DE
MALKOMES, Niels; DE
Agent:
PFENNING, MEINIG & PARTNER GbR; Mozartstrasse 17 80336 München, DE
Priority Data:
199 56 733.625.11.1999DE
Title (EN) METHOD FOR REGULATING SPUTTERING PROCESSES
(FR) PROCEDE POUR REGULER LES PROCESSUS DE PULVERISATION CATHODIQUE
(DE) VERFAHREN ZUR REGELUNG VON SPUTTERPROZESSEN
Abstract:
(EN) The invention relates to a method for regulating medium-frequency or high-frequency sputtering processes. The method is characterised in that a concordant analysis of the electrical discharge parameters is carried out and the MF or HF output and/or the reactive gas flow is regulated, according to the results of the analysis.
(FR) L'invention concerne un procédé pour réguler les processus de pulvérisation cathodique à moyenne ou haute fréquence, ce procédé étant caractérisé en ce que les paramètres de décharge électrique sont soumis à une analyse de Fourier dont les résultats permettent de réguler la puissance à moyenne ou haute fréquence et/ou le flux du gaz réactif.
(DE) Die Erfindung betrifft ein Verfahren zur Regelung von MF- oder HF-Sputterprozessen, wobei eine harmonische Analyse der elektrischen Entladungsparameter durchgeführt und aufgrund der Analyseresultate die MF- bzw. HF-Leistung und/oder der Reaktivgasfluß geregelt wird.
Designated States: JP, KR, US
European Patent Office (EPO) (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE, TR)
Publication Language: German (DE)
Filing Language: German (DE)