Search International and National Patent Collections

1. (WO2001038417) POLYARYLENE COMPOSITIONS WITH ENHANCED MODULUS PROFILES

Pub. No.:    WO/2001/038417    International Application No.:    PCT/US2000/029963
Publication Date: Fri Jun 01 01:59:59 CEST 2001 International Filing Date: Wed Nov 01 00:59:59 CET 2000
IPC: C08G 61/00
C08G 61/10
C08L 65/00
H01L 23/532
Applicants: DOW GLOBAL TECHNOLOGIES INC.
Inventors: GODSCHALX, James, P.
BRUZA, Kenneth, J.
NIU, Qing, Shan, J.
CUMMINS, Clark, H.
TOWNSEND, Paul, H., III
Title: POLYARYLENE COMPOSITIONS WITH ENHANCED MODULUS PROFILES
Abstract:
This invention is a polyarylene composition in which resin does not undergo a significant drop in modulus at temperatures above 300 °C during cure. This feature enables one to form porous films by avoiding pore collapse and/or using a wider variety of poragen materials.