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1. (WO2001037090) A MEMORY EXPANSION MODULE WITH STACKED MEMORY PACKAGES

Pub. No.:    WO/2001/037090    International Application No.:    PCT/US2000/031439
Publication Date: Sat May 26 01:59:59 CEST 2001 International Filing Date: Thu Nov 16 00:59:59 CET 2000
IPC: G06F 11/00
G06F 11/10
G11C 5/04
G11C 8/12
Applicants: SUN MICROSYSTEMS, INC.
Inventors: WONG, Tayung
CARRILLO, John
ROBINSON, Jay
FANG, Clement
JEFFREY, David
VAIDYA, Nikhil
MITTY, Nagaraj
Title: A MEMORY EXPANSION MODULE WITH STACKED MEMORY PACKAGES
Abstract:
A memory expansion module with stacked memory packages. A memory module is implemented using stacked memory packages. Each of the stacked memory packages contains multiple memory chips, typically DRAMs (dynamic random access memory). The memory may be organized into multiple banks, wherein a given memory chip within a stacked memory package is part of one bank, while another memory chip in the same package is part of another bank. The memory module also includes a clock driver chip and a storage unit. The storage unit is configured to store module identification information, such as a serial number. The storage unit is also configured to store information correlating electrical contact pads on the module with individual signal pins on the stacked memory packages. This may allow an error to be quickly traced to a specific pin on a stacked memory package when an error is detected on the memory bus by an error correction subsystem.