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1. (WO2001036539) THERMOPLASTIC RESIN COMPOSITION CONTAINING THERMOPLASTIC POLYMER CONTAINING ALICYCLIC GROUP AND MOLDED OBJECT
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2001/036539 International Application No.: PCT/JP2000/008087
Publication Date: 25.05.2001 International Filing Date: 16.11.2000
Chapter 2 Demand Filed: 23.03.2001
IPC:
C07C 69/54 (2006.01) ,G11B 7/2536 (2013.01) ,G11B 7/2538 (2013.01)
C CHEMISTRY; METALLURGY
07
ORGANIC CHEMISTRY
C
ACYCLIC OR CARBOCYCLIC COMPOUNDS
69
Esters of carboxylic acids; Esters of carbonic or haloformic acids
52
Esters of acyclic unsaturated carboxylic acids having the esterified carboxyl group bound to an acyclic carbon atom
533
Monocarboxylic acid esters having only one carbon-to-carbon double bond
54
Acrylic acid esters; Methacrylic acid esters
G PHYSICS
11
INFORMATION STORAGE
B
INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
7
Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation, reproducing using an optical beam at lower power; Record carriers therefor
24
Record carriers characterised by shape, structure or physical properties, or by the selection of the material 
241
Record carriers characterised by the selection of the material
252
of layers other than recording layers
253
of substrates
2533
comprising resins
2536
polystyrene [PS]
G PHYSICS
11
INFORMATION STORAGE
B
INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
7
Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation, reproducing using an optical beam at lower power; Record carriers therefor
24
Record carriers characterised by shape, structure or physical properties, or by the selection of the material 
241
Record carriers characterised by the selection of the material
252
of layers other than recording layers
253
of substrates
2533
comprising resins
2538
polycycloolefins [PCO]
Applicants:
YAMAURA, Michio [JP/JP]; JP (UsOnly)
KIDO, Nobuaki [JP/JP]; JP (UsOnly)
MATSUMURA, Shunichi [JP/JP]; JP (UsOnly)
IWATA, Kaoru [JP/JP]; JP (UsOnly)
HASHIDZUME, Kiyonari [JP/JP]; JP (UsOnly)
KOHNO, Kazuteru [JP/JP]; JP (UsOnly)
TEIJIN LIMITED [JP/JP]; 6-7, Minamihommachi 1-chome Chuo-ku Osaka-shi Osaka 541-0054, JP (AllExceptUS)
BAYER AG [DE/DE]; 51368 Leverkusen, DE (AE, AG, AL, AM, AT, AU, AZ, BA, BB, BE, BF, BG, BJ, BR, BY, BZ, CA, CF, CG, CH, CI, CM, CN, CR, CU, CY, CZ, DE, DK, DM, DZ, EE, ES, FI, FR, GA, GB, GD, GE, GH, GM, GN, GR, GW, HR, HU, ID, IE, IL, IN, IS, IT, KE, KG, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MC, MD, MG, MK, ML, MN, MR, MW, MX, MZ, NE, NL, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, SN, SZ, TD, TG, TJ, TM, TR, TT, TZ, UA, UG, UZ, VN, YU, ZA, ZW)
Inventors:
YAMAURA, Michio; JP
KIDO, Nobuaki; JP
MATSUMURA, Shunichi; JP
IWATA, Kaoru; JP
HASHIDZUME, Kiyonari; JP
KOHNO, Kazuteru; JP
Agent:
OHSHIMA, Masataka; Ohshima Patent Office Fukuya Building 3, Yotsuya 4-chome Shinjuku-ku Tokyo 160-0004, JP
Priority Data:
11/32857818.11.1999JP
11/33971330.11.1999JP
2000/13832011.05.2000JP
Title (EN) THERMOPLASTIC RESIN COMPOSITION CONTAINING THERMOPLASTIC POLYMER CONTAINING ALICYCLIC GROUP AND MOLDED OBJECT
(FR) COMPOSITION A BASE DE RESINE THERMOPLASTIQUE CONTENANT UN POLYMERE THERMOPLASTIQUE A GROUPES ALICYCLIQUES; OBJET MOULE
Abstract:
(EN) A thermoplastic resin composition (molding material) in which the problem that thermoplastic resins such as hydrogenated styrene polymers suffer a decrease in molecular weight upon melt molding and hence come to be mechanically brittle, is mitigated and which does not develop craze spots even when used in a high-temperature high-humidity atmosphere; and a substrate for optical recording media which comprises the composition. The thermoplastic resin composition comprises a thermoplastic polymer containing alicyclic groups and an addition-type stabilizer which can react by addition reaction with a free radical resulting from cleavage of the thermoplastic polymer.
(FR) Cette invention concerne une résine thermoplastique (matière à mouler) qui se en ce qu'elle est moins sujette à un problème propre à certaines résines de ce type baisse du poids moléculaire lors du moulage en fusion et donc tendance à la fragilité mécanique et dans laquelle n'apparaissent pas de zones de fissures, même en cas d'exposition à une atmosphère très chaude et très humide. L'invention concerne également un substrat pour supports d'enregistrement optique renfermant ladite composition. Cette composition à base de résine thermoplastique comprend un polymère thermoplastique renfermant des groupes alicycliques et un stabilisateur de type addition pouvant réagir par réaction d'addition avec un radical libre du au clivage du polymère thermoplastique.
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Designated States: AE, AG, AL, AU, BA, BB, BG, BR, BZ, CA, CN, CR, CU, CZ, DM, DZ, EE, GD, GE, HR, HU, ID, IL, IN, IS, JP, KR, LC, LK, LR, LT, LV, MA, MG, MK, MN, MX, NO, NZ, PL, RO, SG, SI, SK, TR, TT, UA, US, UZ, VN, YU, ZA
African Regional Intellectual Property Organization (ARIPO) (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)