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1. (WO2001036181) METHOD OF DRY-ETCHING RESIN FILM AND DEVICE THEREFOR

Pub. No.:    WO/2001/036181    International Application No.:    PCT/JP2000/007995
Publication Date: Sat May 26 01:59:59 CEST 2001 International Filing Date: Tue Nov 14 00:59:59 CET 2000
IPC: B29C 59/14
H01L 21/311
H05K 3/00
Applicants: TORAY ENGINEERING COMPANY, LIMITED

SHINKO SEIKI CO., LTD.

HAMANAKA, Ryomyo

NAKANO, Yoshimasa

TAKEUCHI, Tatsuya

FUKUMOTO, Shinsuke

Inventors: HAMANAKA, Ryomyo

NAKANO, Yoshimasa

TAKEUCHI, Tatsuya

FUKUMOTO, Shinsuke

Title: METHOD OF DRY-ETCHING RESIN FILM AND DEVICE THEREFOR
Abstract:
Either one of laminate materials formed by laminating metal foils on a resin film element material and a resin film is used as an untreated material (F), a heating table (3) is brought into close contact with one-side surface and an etching opening pattern-formed mask (4) is brought into close contact with the opposite-side surface so as to sandwich the untreated material (F) therebetween, and the untreated material is gas-etched from the mask (4) side under a vacuum atmosphere with the close contact conditions maintained.