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1. (WO2001035450) COMPOUND SEMICONDUCTOR WAFER

Pub. No.:    WO/2001/035450    International Application No.:    PCT/JP2000/007803
Publication Date: Fri May 18 01:59:59 CEST 2001 International Filing Date: Wed Nov 08 00:59:59 CET 2000
IPC: C30B 33/00
H01L 21/304
Applicants: NIKKO MATERIALS CO., LTD.

WATATANI, Kenichi

Inventors: WATATANI, Kenichi

Title: COMPOUND SEMICONDUCTOR WAFER
Abstract:
A semiconductor wafer with a beveled edge, whose backside and beveled edge have a non-mirror finish, that is, they are finished to satisfy the relation: (average surface roughness of beveled edge) (average surface roughness of backside) ≤ 5 νm.