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1. (WO2001034868) CORRECTION METHOD AND DEVICE FOR SPUTTERING TARGET/PACKING PLATE ASSEMBLY

Pub. No.:    WO/2001/034868    International Application No.:    PCT/JP2000/004827
Publication Date: Fri May 18 01:59:59 CEST 2001 International Filing Date: Thu Jul 20 01:59:59 CEST 2000
IPC: C23C 14/34
H01J 37/34
Applicants: NIKKO MATERIALS COMPANY, LIMITED

Inventors: NAKASHIMA, Koichi

SEKI, Takakazu

ISIZUKA, Keiichi

Title: CORRECTION METHOD AND DEVICE FOR SPUTTERING TARGET/PACKING PLATE ASSEMBLY
Abstract:
A correction method for a sputtering target/packing plate assembly, which corrects by vacuum-suction an assembly formed by joining a sputtering target and a packing plate together. When a strain such as a warp and deformation occurred in a sputtering target-packing plate joining process is to be corrected during a target, especially, a ceramics target production process, a strain such as a warp of the target is effectively corrected by a means for uniforming a pressure applied to the sputtering target without cracking to thereby obtain a correction method for a sputtering target/packing plate assembly, and a correction device therefor.