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1. (WO2001033927) INTER-CIRCUIT ENCAPSULATED PACKAGING FOR POWER DELIVERY
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2001/033927 International Application No.: PCT/US2000/029452
Publication Date: 10.05.2001 International Filing Date: 24.10.2000
Chapter 2 Demand Filed: 16.05.2001
IPC:
G06F 1/18 (2006.01) ,H01R 4/64 (2006.01) ,H05K 1/02 (2006.01) ,H05K 1/14 (2006.01) ,H05K 3/36 (2006.01) ,H05K 7/10 (2006.01)
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
1
Details not covered by groups G06F3/-G06F13/82
16
Constructional details or arrangements
18
Packaging or power distribution
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
4
Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
58
characterised by the form or material of the contacting members
64
Connections between or with conductive parts having primarily a non-electric function, e.g. frame, casing, rail
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
14
Structural association of two or more printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
36
Assembling printed circuits with other printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
02
Arrangements of circuit components or wiring on supporting structure
10
Plug-in assemblages of components
Applicants:
INCEP TECHNOLOGIES, INC. [US/US]; 10650 Treena Street Suite 308 San Diego, CA 92131, US
Inventors:
DIBENE, Joseph, Ted, II; US
HARTKE, David; US
Agent:
COOPER, Victor, G; Gates & Cooper LLP Suite 1050 6701 Center Drive West Los Angeles, CA 90045, US
Priority Data:
09/432,87802.11.1999US
Title (EN) INTER-CIRCUIT ENCAPSULATED PACKAGING FOR POWER DELIVERY
(FR) BOITIER ENCAPSULE INTER-CIRCUITS POUR DISTRIBUTION D'ENERGIE
Abstract:
(EN) An encapsulated circuit assembly and methods for making an encapsulated circuit assembly for power delivery are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a mechanical coupler. The mechanical coupler is coupled between the first printed circuit board and the second printed circuit board and disposed between the first printed circuit board and the second printed circuit board. The mechanical coupler provides substantial electrical continuity between a trace on the first printed circuit board and a trace on the second printed circuit board.
(FR) L'invention concerne un ensemble de circuits encapsulés et des procédés de fabrication d'un ensemble de circuits encapsulés destinés à améliorer la distribution d'énergie. Cet ensemble comprend une première carte à circuit imprimé, une second carte à circuit imprimé et un coupleur mécanique. Ce coupleur mécanique est couplé entre la première carte à circuit imprimé et la seconde carte à circuit imprimé et disposé entre la première carte à circuit imprimé et la seconde carte à circuit imprimé. Ledit coupleur mécanique offre une bonne continuité électrique entre une impression conductrice ménagée sur la première carte à circuit imprimé et une impression conductrice formée sur la seconde carte à circuit imprimé.
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Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CR, CU, CZ, DE, DK, DM, DZ, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, TZ, UA, UG, UZ, VN, YU, ZA, ZW
African Regional Intellectual Property Organization (ARIPO) (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)