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1. (WO2001033922) PRINTED CIRCUIT BOARD
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2001/033922 International Application No.: PCT/EP2000/010154
Publication Date: 10.05.2001 International Filing Date: 13.10.2000
IPC:
H05K 1/02 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
Applicants: KONINKLIJKE PHILIPS ELECTRONICS N.V.[NL/NL]; Groenewoudseweg 1 NL-5621 BA Eindhoven, NL
Inventors: MIES, Cornelis, J.; NL
Agent: BOSMA, Rudolphus, H., A.; Internationaal Octrooibureau B.V. Prof Holstlaan 6 NL-5656 AA Eindhoven, NL
Priority Data:
99203607.902.11.1999EP
Title (EN) PRINTED CIRCUIT BOARD
(FR) CARTE DE CIRCUIT IMPRIME
Abstract:
(EN) In a printed circuit board comprising a track pattern (L1) and a substrate (DP), an additional layer (L3) of copper is provided, which is electrically insulated from the track pattern by a layer of an insulating material (L2). Both these layers (L2, L3) are situated between the track pattern (L1) and the substrate (DP). During operation of a circuit obtained by making use of the printed circuit board, the additional layer (L3) serves as a heat spreader, resulting in an efficient transport of the heat generated by components (C1, C2) in the circuit.
(FR) La présente invention concerne une carte de circuit imprimé comprenant un motif (L1) et un substrat (DP), comportant une couche supplémentaire (L3) de cuivre qui est électriquement isolée du motif par une couche de matériau isolant (L2). Les couches (L2, L3) se trouvent toutes deux entre le motif (L1) et le substrat (DP). Durant le fonctionnement d'un circuit obtenu par l'utilisation d'une carte de circuit imprimé, la couche supplémentaire (L3) sert de dissipateur thermique permettant une bonne évacuation de la chaleur produite par les composants (C1, C2) du circuit.
front page image
Designated States: CN, JP
European Patent Office (EPO) (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
Publication Language: English (EN)
Filing Language: English (EN)