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1. (WO2001033636) OPTICAL SEMICONDUCTOR HOUSING AND METHOD FOR MAKING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2001/033636 International Application No.: PCT/FR2000/003021
Publication Date: 10.05.2001 International Filing Date: 30.10.2000
Chapter 2 Demand Filed: 31.05.2001
IPC:
H01L 25/16 (2006.01) ,H01L 31/0203 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
16
the devices being of types provided for in two or more different main groups of groups H01L27/-H01L51/139
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31
Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
Details
0203
Containers; Encapsulations
Applicants:
EXPOSITO, Juan [FR/FR]; FR (UsOnly)
BRECHIGNAC, Rémi [FR/FR]; FR (UsOnly)
STMICROELECTRONICS SA [FR/FR]; 7, avenue Galliéni F-94250 Gentilly, FR (AllExceptUS)
Inventors:
EXPOSITO, Juan; FR
BRECHIGNAC, Rémi; FR
Agent:
BUREAU D.A. CASALONGA JOSSE; 8, avenue Percier F-75008 Paris, FR
CASALONGA, Axel; Bureau D.A. Casalonga-Josse Morassistrasse 8 80469 Munich, DE
Priority Data:
99/1377704.11.1999FR
Title (EN) OPTICAL SEMICONDUCTOR HOUSING AND METHOD FOR MAKING SAME
(FR) BOÎTIER SEMI-CONDUCTEUR OPTIQUE ET PROCEDE DE FABRICATION D'UN TEL BOÎTIER
Abstract:
(EN) The invention concerns an optical semiconductor housing and a method for making an optical semiconductor housing, wherein: a first rear face of a semiconductor component (3) such as a microprocessor is borne by a front face of an electrical connection support plate (1), a rear face of a second semiconductor component (11) is fixed on a front face of said first component (3) and a front face of said second component comprises an optical sensor (13), first electrical connection means (6) connect said first component to the front face of said support plate, second electrical connection means (14) connect said second component to the front face of said support plate, means (17) are provided for encapsulating said components stacked on said support plate and said electrical connection means and comprise a transparent material opposite said optical sensor, and external electrical connection means (24) are arranged on an exposed part of said support plate.
(FR) Boîtier semi-conducteur optique et son procédé de fabrication, dans lesquels: une face arrière d'un premier composant semi-conducteur (3) tel qu'un microprocesseur est portée par une face avant d'une plaque support (1) de connexion électrique, une face arrière d'un second composant semi-conducteur (11) est fixée sur une face avant dudit premier composant (3) et une face avant de ce second composant comprend un capteur optique (13), des premiers moyens de connexion électrique (6) relient ledit premier composant à la face avant de ladite plaque support, des seconds moyens de connexion électrique (14) relient ledit second composant à la face avant de ladite plaque support, des moyens (17) assurent l'encapsulage desdits composants empilés sur ladite plaque support et lesdits moyens de connexion électrique et comprennent un matériau transparent en face dudit capteur optique, et des moyens de connexion électrique extérieure (24) sont disposés sur une partie découverte de ladite plaque support.
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Designated States: JP, US
European Patent Office (EPO) (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
Publication Language: French (FR)
Filing Language: French (FR)