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1. (WO2001033623) SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2001/033623 International Application No.: PCT/JP1999/006021
Publication Date: 10.05.2001 International Filing Date: 29.10.1999
Chapter 2 Demand Filed: 29.10.1999
IPC:
H01L 21/56 (2006.01) ,H01L 25/10 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56
Encapsulations, e.g. encapsulating layers, coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
10
the devices having separate containers
Applicants: KADO, Yoshiyuki[JP/JP]; JP (UsOnly)
KIKUCHI, Hiroshi[JP/JP]; JP (UsOnly)
YOSHIDA, Ikuo[JP/JP]; JP (UsOnly)
SATO, Toshihiko[JP/JP]; JP (UsOnly)
SAKAUE, Masakazu[JP/JP]; JP (UsOnly)
KOUYANAGI, Hiroshi[JP/JP]; JP (UsOnly)
HITACHI, LTD.[JP/JP]; 6, Kanda Surugadai 4-chome Chiyoda-ku, Tokyo 101-8010, JP (AllExceptUS)
Inventors: KADO, Yoshiyuki; JP
KIKUCHI, Hiroshi; JP
YOSHIDA, Ikuo; JP
SATO, Toshihiko; JP
SAKAUE, Masakazu; JP
KOUYANAGI, Hiroshi; JP
Agent: TSUTSUI, Yamato; Tsutsui & Associates N.S.Excel 301 22-45, Nishi-shinjuku 7-chome Shinjuku-ku, Tokyo 160-0023, JP
Priority Data:
Title (EN) SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
(FR) DISPOSITIF SEMI-CONDUCTEUR ET SON PROCEDE DE FABRICATION
Abstract:
(EN) A semiconductor flip chip (1) is positioned on a support substrate (2) precisely. A semiconductor device comprises a semiconductor chip having pads (1b) on its major surface (1a), a support substrate having a wiring section (2b) electrically connected to the pads, an insulating layer (2c) formed around the wiring section, and a recessed section (2f) which is made in a connection surface (2e) of the wiring section and of which the height from an mounting surface (2d) is lower than the insulating layer, a gold bump (4) positioned by the recessed section and interposed between the pads of the semiconductor chip and the wiring section, and an ACF (3) for ensuring the connection between the gold bump and the wiring section. When the semiconductor chip is mounted, the gold bump is precisely positioned on the wiring section.
(FR) L'invention concerne des puces à protubérances (1) semi-conductrices placées avec précision sur un support de substrat. Un dispositif semi-conducteur comporte une puce semi-conductrice dotée d'atténuateurs (1b) sur sa grande surface (1a), un support de substrat pourvu d'une section de câblage (2b) électriquement connectée aux atténuateurs, une couche isolante (2c) formée autour de la section de câblage et une section évidée (2f) constituée dans une surface de connexion (2e) de la section de câblage et dont la hauteur à partir d'une surface de montage (2d) est inférieure à celle de la couche isolante, une protubérance dorée (4) placée près de la section évidée et interposée entre les atténuateurs de la puce semi-conductrice et la section de câblage, et un ACF (3) pour assurer la connexion entre cette section et la protubérance dorée. Lorsque la puce semi-conductrice est montée, la protubérance dorée est placée avec précision sur ladite section.
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Designated States: CN, JP, KR, SG, US
European Patent Office (EPO) (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)