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Machine translation
1. (WO2001026147) SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURE THEREOF, CIRCUIT BOARD, AND ELECTRONIC DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2001/026147    International Application No.:    PCT/JP2000/006767
Publication Date: 12.04.2001 International Filing Date: 29.09.2000
IPC:
H01L 21/56 (2006.01), H01L 21/60 (2006.01), H01L 23/31 (2006.01), H01L 23/485 (2006.01)
Applicants: SEIKO EPSON CORPORATION [JP/JP]; 4-1, Nishi-shinjuku 2-chome, Shinjuku-ku, Tokyo 163-0811 (JP) (For All Designated States Except US).
HASHIMOTO, Nobuaki [JP/JP]; (JP) (For US Only)
Inventors: HASHIMOTO, Nobuaki; (JP)
Agent: INOUE, Hajime; 2nd Floor, Ogikubo TM Bldg. 26-13, Ogikubo 5-chome, Suginami-ku, Tokyo 167-0051 (JP)
Priority Data:
11/282474 04.10.1999 JP
Title (EN) SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURE THEREOF, CIRCUIT BOARD, AND ELECTRONIC DEVICE
(FR) DISPOSITIF A SEMI-CONDUCTEUR, SON PROCEDE DE FABRICATION, CARTE DE CIRCUIT IMPRIME ET DISPOSITIF ELECTRONIQUE
Abstract: front page image
(EN)A semiconductor device comprises a substrate (30) having a plurality of holes (36) and having wiring patterns (32) on one side, part of wiring patterns (32) overlying the holes (36) horizontally; a semiconductor chip (10) having a plurality of electrodes (12) and arranged on the other side of the substrate (30) with the electrodes (12) corresponding to the holes; and conductors arranged through the holes (36) to connect the electrodes (12) and the wiring patterns (32) electrically.
(FR)L'invention concerne un dispositif à semi-conducteur comprenant un substrat (30) perforé (36) présentant des schémas de filage (32) sur un côté dont une partie recouvre les orifices (36) horizontalement, une microplaquette semi-conductrice (10) dotée d'une pluralité d'électrodes (12) et disposée sur l'autre côté du substrat (30), les électrodes (12) étant placées de manière à correspondre aux orifices ainsi que des conducteurs disposés à travers les orifices (36) afin de connecter par voie électrique les électrodes (12) et les schémas de filage (32).
Designated States: CN, JP, KR, US.
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)