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Machine translation
1. (WO2001023636) METHOD AND APPARATUS FOR CONTROLLING CHAMBER SURFACES IN A SEMICONDUCTOR PROCESSING REACTOR
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2001/023636    International Application No.:    PCT/US2000/041001
Publication Date: 05.04.2001 International Filing Date: 26.09.2000
Chapter 2 Demand Filed:    04.04.2001    
IPC:
C23C 14/56 (2006.01), C23C 16/44 (2006.01)
Applicants: LAM RESEARCH CORPORATION [US/US]; 4650 Cushing Parkway, Fremont, CA 94538-6516 (US)
Inventors: KENNARD, Mark, A.; (US).
NI, Tuqiang; (US)
Agent: LEE, Michael; Beyer Weaver & Thomas, LLP, Post Office Box 778, Berkeley, CA 94704-0778 (US).
OLYNICK, Mary, R.; Beyer Weaver & Thomas, LLP, Post Office Box 778, Berkeley, CA 94704-0778 (US)
Priority Data:
09/409,804 30.09.1999 US
Title (EN) METHOD AND APPARATUS FOR CONTROLLING CHAMBER SURFACES IN A SEMICONDUCTOR PROCESSING REACTOR
(FR) PROCEDE ET APPAREIL DE CONTROLE DES SURFACES DE LA CHAMBRE D'UN REACTEUR DE TRAITEMENT DE SEMI-CONDUCTEUR
Abstract: front page image
(EN)A system for processing a substrate using a process gas is disclosed. The system forming volatile and non-volatile species during processing. The system includes a process chamber within which the processing is performed. The process chamber being configured to enclose the substrate, and having a chamber surface proximate to the substrate. The system further includes a chamber surface protection arrangement configured for shielding the surface from the non-volatile species formed during processing. The chamber surface protection arrangement includes an adsorbing film that is disposed inside the process chamber and substantially adjacent to the chamber surface. The adsorbing film being configured to prevent the non-volatile species from contacting the chamber surface, and arranged to adsorb a substantial portion of the non-volatile species that contact the adsorbing film. The adsorbing film further being arranged for removing the adsorbed non-volatile species from the process chamber.
(FR)L'invention porte sur un système de traitement d'un substrat à l'aide d'un gaz de processus générant des substances volatiles et non volatiles. Ledit système inclut une chambre de traitement renfermant le substrat et comprenant une surface voisine du substrat et un dispositif protégeant pendant le traitement ladite surface contre les substances non volatiles et consistant en un film adsorbant placé dans la chambre et jouxtant sensiblement la susdite surface. Ledit film, qui empêche les substances non volatiles d'entrer en contact avec la surface de la chambre, et en adsorbe une quantité substantielle, sert en outre à adsorber les substances non volatiles présentes dans la chambre.
Designated States: IL, JP, KR, SG.
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE).
Publication Language: English (EN)
Filing Language: English (EN)