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Machine translation
1. (WO2001023486) COMPOSITIONS FOR AND METHODS OF REDUCING/ELIMINATING SCRATCHES AND DEFECTS IN SILICON DIOXIDE CMP PROCESS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2001/023486    International Application No.:    PCT/US2000/024342
Publication Date: 05.04.2001 International Filing Date: 05.09.2000
Chapter 2 Demand Filed:    11.01.2001    
IPC:
C09G 1/02 (2006.01), H01L 21/3105 (2006.01)
Applicants: INFINEON TECHNOLOGIES NORTH AMERICA CORP. [US/US]; 1730 North First Street, San Jose, CA 95112-4508 (US).
INTERNATIONAL BUSINESS MACHINES CORPORATION [US/US]; New Orchard Road, Armonk, NY 10504 (US)
Inventors: NOJO, Haruki; (US).
SCHUTZ, Ronald, J.; (US).
RAMACHANDRAN, Ravikumar; (US)
Agent: BRADEN, Stanton, C.; Siemens Corporation, Intellectual Property Dept., 186 Wood Ave. South, Iselin, NJ 08830 (US).
WESTPHAL, MUSSGNUG & PARTNER; Waldstr.33, 78048 Villingen-Schwennningen (DE)
Priority Data:
09/409,464 30.09.1999 US
Title (EN) COMPOSITIONS FOR AND METHODS OF REDUCING/ELIMINATING SCRATCHES AND DEFECTS IN SILICON DIOXIDE CMP PROCESS
(FR) COMPOSITIONS ET PROCEDES PERMETTANT DE REDUIRE/ELIMINER LES RAYURES ET LES DEFAUTS PRODUITS AU COURS D'UN PROCEDE DE POLISSAGE CHIMICO-MECANIQUE D'OXYDE DE SILICIUM
Abstract: front page image
(EN)An aqueous slurry-less composition for chemical-mechanical-polishing of a silicon dioxide workpiece comprising: a cationic surfactant that is soluble and ionized at neutral to alkaline pH conditions, in which the cationic surfactant is present in an aqueous slurry-less composition in an amount less than its critical micelle concentration.
(FR)L'invention concerne une composition aqueuse sans bouillie utilisée pour le polissage chimico-mécanique d'une pièce d'oxyde de silicium, comprenant un tensioactif cationique soluble, ionisé dans des conditions de pH neutres à alcalines, le tensioactif cationique étant présent dans la composition aqueuse sans bouillie dans une concentration inférieure à sa concentration critique en micelles.
Designated States: CN, JP, KR.
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE).
Publication Language: English (EN)
Filing Language: English (EN)