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1. WO2001014135 - ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL AND COPPER-CLAD LAMINATE USING THE ELECTROLYTIC COPPER FOIL

Publication Number WO/2001/014135
Publication Date 01.03.2001
International Application No. PCT/JP2000/002225
International Filing Date 06.04.2000
IPC
C25D 1/04 2006.1
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
1Electroforming
04Wires; Strips; Foils
C25D 1/22 2006.1
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
1Electroforming
20Separation of the formed objects from the electrodes
22Separating compounds
H05K 3/02 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
02in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
CPC
C25D 1/04
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
1Electroforming
04Wires; Strips; Foils
C25D 1/22
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
1Electroforming
20Separation of the formed objects from the electrodes ; with no destruction of said electrodes
22Separating compounds
H05K 1/03
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
H05K 3/025
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
02in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
025by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
Y10T 428/12556
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
428Stock material or miscellaneous articles
12All metal or with adjacent metals
12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
12535with additional, spatially distinct nonmetal component
12556Organic component
Y10T 428/12903
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
428Stock material or miscellaneous articles
12All metal or with adjacent metals
12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
12771Transition metal-base component
12861Group VIII or IB metal-base component
12903Cu-base component
Applicants
  • MITSUI MINING & SMELTING CO., LTD. [JP]/[JP] (AllExceptUS)
  • YOSHIOKA, Atsushi [JP]/[JP] (UsOnly)
  • SUGIMOTO, Akiko [JP]/[JP] (UsOnly)
  • TAENAKA, Sakiko [JP]/[JP] (UsOnly)
  • DOBASHI, Makoto [JP]/[JP] (UsOnly)
  • HIGUCHI, Tsutomu [JP]/[JP] (UsOnly)
  • YAMAMOTO, Takuya [JP]/[JP] (UsOnly)
  • IWAKIRI, Kenichiro [JP]/[JP] (UsOnly)
Inventors
  • YOSHIOKA, Atsushi
  • SUGIMOTO, Akiko
  • TAENAKA, Sakiko
  • DOBASHI, Makoto
  • HIGUCHI, Tsutomu
  • YAMAMOTO, Takuya
  • IWAKIRI, Kenichiro
Agents
  • TANAKA, Daisuke
Priority Data
11/23756524.08.1999JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL AND COPPER-CLAD LAMINATE USING THE ELECTROLYTIC COPPER FOIL
(FR) FEUILLE DE CUIVRE ELECTROLYTIQUE AVEC FEUILLE DE SUPPORT ET STRATIFIE PLAQUE CUIVRE UTILISANT CETTE FEUILLE DE CUIVRE ELECTROLYTIQUE
Abstract
(EN) Electrolytic copper foil with carrier foil, which can easily form in a printed circuit board through holes (PTH) by a laser method, interstitial via holes (IVH) and blind via holes (BVH), and which is obtained by forming an organic surface phase on the surface of carrier foil and by depositing and forming an electrolytic copper foil layer on the surface phase, characterized in that the carrier foil has fine copper particles deposited and formed on the surface thereof on which the organic surface phase and the electrolytic copper foil layer are to be deposited and formed.
(FR) La présente invention concerne une feuille de cuivre électrolytique pourvue d'une feuille de support, pouvant facilement former dans une plaquette de circuits imprimés des trous traversants (PTH) par procédé laser, des trous traversants interstitiels (IVH) et des trous traversants borgnes (BVH). On peut obtenir cette feuille de cuivre en formant une phase de surface organique sur la surface de la feuille de support et en déposant et en formant une couche de feuille de cuivre électrolytique sur la phase de surface. Cette feuille de cuivre est caractérisée en ce qu'elle contient de fines particules de cuivre déposées et formées sur sa surface sur laquelle la phase de surface organique et la couche de feuille de cuivre électrolytique doivent être déposées et formées.
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