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1. (WO2001006818) CIRCUITRY WITH INTEGRATED PASSIVE COMPONENTS AND METHOD FOR PRODUCING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2001/006818 International Application No.: PCT/GB2000/002679
Publication Date: 25.01.2001 International Filing Date: 13.07.2000
Chapter 2 Demand Filed: 22.01.2001
IPC:
H01F 17/00 (2006.01) ,H01F 41/04 (2006.01) ,H05K 1/09 (2006.01) ,H05K 1/16 (2006.01) ,H05K 3/00 (2006.01) ,H05K 3/38 (2006.01) ,H05K 3/40 (2006.01) ,H05K 3/46 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
F
MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
17
Fixed inductances of the signal type
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
F
MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
41
Apparatus or processes specially adapted for manufacturing or assembling the devices covered by this subclass
02
for manufacturing cores, coils or magnets
04
for manufacturing coils
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
09
Use of materials for the metallic pattern
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
16
incorporating printed electric components, e.g. printed resistor, capacitor, inductor
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
38
Improvement of the adhesion between the insulating substrate and the metal
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
40
Forming printed elements for providing electric connections to or between printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
46
Manufacturing multi-layer circuits
Applicants:
INTERNATIONAL BUSINESS MACHINES CORPORATION [US/US]; New Orchard Road Armonk, NY 10504, US
IBM UNITED KINGDOM LIMITED [GB/GB]; North Harbour P.O. Box 41 Portsmouth Hampshire PO6 3AU, GB (MC)
Inventors:
LAUFFER, John; US
RUSSELL, David; US
Agent:
MOSS, Robert, Douglas; IBM United Kingdom Limited Intellectual Property Department Hursley Park Winchester Hampshire SO21 2JN, GB
Priority Data:
09/353,99215.07.1999US
Title (EN) CIRCUITRY WITH INTEGRATED PASSIVE COMPONENTS AND METHOD FOR PRODUCING SAME
(FR) ENSEMBLE DE CIRCUITS A COMPOSANTS PASSIFS INTEGRES ET LEUR PROCEDE DE PRODUCTION
Abstract:
(EN) Passive electrical components such as capacitors, resistors, inductors, transformers, filters and resonators are integrated into electrical circuits utilizing a process which maximizes the utilization of the planar surfaces of the substrates for high density placement of active components such as logic or memory integrated circuits. The passive components are integrated into a conventional circuit board utilizing a photoimageable dielectric material (20). The dielectric (20) is photoimaged and etched to provide one or more recesses or openings (26) for the passive devices, and photovias interconnecting the inputs and outputs of the integrated circuit board. The electronic structure comprising at least one of the passive devices integrated into a photoimaged dielectric (20) is described as well as the method of manufacturing the same.
(FR) L'invention concerne des composants électriques tels que des condensateurs, des résistances, des bobines d'induction, des transformateurs des filtres et des résonateurs, qui sont intégrés à des circuits électriques grâce à un procédé consistant à maximiser l'utilisation de surfaces planes des substrats pour réaliser un placement haute densité de composants actifs tels que des circuits intégrés logiques ou de mémoire. Les composants passifs sont intégrés dans une plaquette de circuit intégré classique grâce à une matière diélectrique (20) pouvant être photogravée. Le diélectrique (20) est photogravé de manière à présenter un ou plusieurs creux ou ouvertures (26) pour les dispositifs passifs, ainsi que des trous d'interconnexion interconnectant les entrées et sorties de la plaquette de circuit intégré. L'invention concerne aussi une structure électronique comprenant au moins un des dispositifs passifs intégré dans un diélectrique (20) photogravé, de même que son procédé de fabrication.
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Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, BZ, CA, CH, CN, CR, CU, CZ, DE, DK, DM, DZ, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, TZ, UA, UG, UZ, VN, YU, ZA, ZW
African Regional Intellectual Property Organization (ARIPO) (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)