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1. (WO2001006270) WAFER-LEVEL BURN-IN

Pub. No.:    WO/2001/006270    International Application No.:    PCT/US2000/019217
Publication Date: Fri Jan 26 00:59:59 CET 2001 International Filing Date: Sat Jul 15 01:59:59 CEST 2000
IPC: G01R 31/28
G01R 31/3163
G01R 31/3185
Applicants: ALPINE MICROSYSTEMS, INC.
Inventors: WIGGIN, Andrew, K.
CALAMONERI, Allan
GOETZ, Martin, P.
ZSAIO, John
AVERY, George, E.
BROWN, Sammy, K.
Title: WAFER-LEVEL BURN-IN
Abstract:
A method and a system for wafer (10) level burn-in testing of a circuit (12) featuring a flip-jumper (26) to permit selectively connecting signals (20) to the interconnect sites (22a and 22b) on the wafer (10) that are in constant electrical communication with the circuit (12).