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1. (WO2001006029) SPUTTERING TARGET

Pub. No.:    WO/2001/006029    International Application No.:    PCT/JP2000/002865
Publication Date: Fri Jan 26 00:59:59 CET 2001 International Filing Date: Tue May 02 01:59:59 CEST 2000
IPC: C23C 14/34
Applicants: NIKKO MATERIALS COMPANY, LIMITED

KUMAHARA, Yoshikazu

ISHIZUKA, Keiichi

Inventors: KUMAHARA, Yoshikazu

ISHIZUKA, Keiichi

Title: SPUTTERING TARGET
Abstract:
A sputtering target, wherein a part, in a grinding direction or grinding tangential direction, on the front surface or both surfaces of the target is parallel to a warping direction after the target is bonded to a backing plate or falls within an angle range of ±45° of the warping direction, or, when the target is rectangular, falls within a range of an angle formed by a warping direction after bonding of the target to the backing plate and a diagonal; the sputtering target being capable of effectively reducing or preventing cracking due to a difference in a thermal expansion coefficient, especially during the production of a ceramic target, that is, during a target-to-backing plate joining process, and also effectively reducing or preventing a similar cracking or warping at sputtering.