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1. (WO2001005555) METHODS AND APPARATUSES FOR PLANARIZING MICROELECTRONIC SUBSTRATE ASSEMBLIES

Pub. No.:    WO/2001/005555    International Application No.:    PCT/US2000/019692
Publication Date: Fri Jan 26 00:59:59 CET 2001 International Filing Date: Thu Jul 20 01:59:59 CEST 2000
IPC: B24B 21/04
B24B 37/24
B24B 37/26
C10M 125/20
C10M 129/08
C10M 145/04
C10M 145/28
C10M 145/30
C10M 173/02
H01L 21/304
C10N 20/02
C10N 40/00
Applicants: MICRON TECHNOLOGY, INC.
Inventors: SABDE, Gundu, M.
LEE, Wonchee
Title: METHODS AND APPARATUSES FOR PLANARIZING MICROELECTRONIC SUBSTRATE ASSEMBLIES
Abstract:
Methods and apparatuses for planarizing microelectronic substrate assemblies (12) on fixed-abrasive polishing pads (40) with non-abrasive lubricating planarizing solutions (170). One aspect of the invention is to deposit a lubricating planarizing solution without abrasive particles onto a fixed-abrasive polishing pad having a body (41), a planarizing surface on the body, and a plurality of abrasive particles fixedly attached to the body at the planarizing surface. The front face of a substrate assembly (12) is pressed against the lubricating planarizing solution (170) and at least a portion of the fixed abrasive particles on the planarizing surface of the polishing pad. At least one of the polishing pad or the substrate assembly is then moved with respect to the other to impart relative motion therebetween. As the substrate assembly moves relative to the polishing pad, regions of the front face are separated from the abrasive particles in the polishing pad (40) by a lubricant-additive (160) in the lubricating planarizing solution (170).