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1. (WO2001004950) DEVICE FOR HEAT DISSIPATION OF SEMICONDUCTOR COMPONENTS IN CASE OF LOAD PEAKS

Pub. No.:    WO/2001/004950    International Application No.:    PCT/DE2000/002074
Publication Date: Fri Jan 19 00:59:59 CET 2001 International Filing Date: Tue Jun 27 01:59:59 CEST 2000
IPC: H01L 23/427
Applicants: SIEMENS AKTIENGESELLSCHAFT
KREUTZER, Rainer
JUNG, Robert
ZERBIAN, Erich
Inventors: KREUTZER, Rainer
JUNG, Robert
ZERBIAN, Erich
Title: DEVICE FOR HEAT DISSIPATION OF SEMICONDUCTOR COMPONENTS IN CASE OF LOAD PEAKS
Abstract:
The invention concerns a device for heat dissipation of a semiconductor component and comprising a semiconductor component and a first cooling body in contact with the semiconductor component and provided with a medium having a low melting point. Said medium melts when the temperature rises, but the fusion does not raise the temperature further. The time interval required to reach thermal destruction of the semiconductor component is thus prolonged, which is particularly advantageous in an engine starting phase when the semiconductor component acts as a control element of the engine.