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1. (WO2001004020) A MATERIAL AND METHOD FOR FORMING A LID ON A PACKAGE

Pub. No.:    WO/2001/004020    International Application No.:    PCT/SE2000/001375
Publication Date: Fri Jan 19 00:59:59 CET 2001 International Filing Date: Fri Jun 30 01:59:59 CEST 2000
IPC: B65D 77/20
Applicants: FREDIN, Sten-Inge
Inventors: FREDIN, Sten-Inge
Title: A MATERIAL AND METHOD FOR FORMING A LID ON A PACKAGE
Abstract:
A lid (4) for a package of blister type comprises a cover film (5) and a label (6). The cover film (5) is heat sealable to a rim (3) of a lower package part (1) in the form of a tray (2) and is provided with a perforation (24) or the like around or over the tray. The label (6) has substantially the same size as the cover film (5), is provided with an adhesive on its underside, and has breakable portions (7) for allowing the label to be lifted breaking said portions and then to be resealed by the adhesive. The lid material is supplied - to a machine for accomplishing packages - as a prefabricated unit, including the cover film with its perforation (24) and the label.