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1. (WO2001003878) SOLDER ALLOY
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2001/003878    International Application No.:    PCT/GB2000/002502
Publication Date: 18.01.2001 International Filing Date: 29.06.2000
Chapter 2 Demand Filed:    07.02.2001    
B23K 35/26 (2006.01), C22C 13/00 (2006.01)
Applicants: MULTICORE SOLDERS LIMITED [GB/GB]; Kelsey House, Wood Lane End, Hemel Hempstead, Hertfordshire HP2 4RQ (GB) (For All Designated States Except US).
STEEN, Hector, Andrew, Hamilton [GB/GB]; (GB) (For US Only)
Inventors: STEEN, Hector, Andrew, Hamilton; (GB)
Agent: SILVERMAN, Warren; Haseltine Lake & Co, Imperial House, 15-19 Kingsway, London WC2B 6UD (GB)
Priority Data:
9915954.3 07.07.1999 GB
Abstract: front page image
(EN)A lead-free solder alloy suitable for use in wave soldering and, in particular with water base VOC-free flux, low-VOC (water base) flux and low solids (solvent base flux consists of tin to which is/are added one or more of Ag in an amount of up to 10 %, Cu in an amount of up to 5 %, Sb in an amount of up to 10 % and Bi in an amount of up to 10 %, which alloy additionally contains phosphorus in an amount of up to 0.01 %, all percentages being on weight basis related to the amount of tin.
(FR)L'invention porte sur un alliage pour soudures sans plomb s'utilisant pour la soudure à vague et en particulier à l'aide de flux aqueux exempt de VOC, de flux aqueux à faible teneur en VOC, et flux de solides à bas point de fusion (étain + un ou plusieurs des éléments suivants: jusqu'à 10 % d'Ag, jusqu'à 5 % de Cu, jusqu'à 10 % de Sb, jusqu'à 10 % de Bi, et jusqu'à 10 % de phosphore, le tout en % du poids d'étain.
Designated States: AE, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BY, CA, CH, CN, CR, CU, CZ, DE, DK, DM, EE, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, NO, NZ, PL, PT, RO, RU, SD, SE, SG, SI, SK, SL, TJ, TM, TR, TT, TZ, UA, UG, US, UZ, VN, YU, ZA, ZW.
African Regional Intellectual Property Organization (GH, GM, KE, LS, MW, MZ, SD, SL, SZ, TZ, UG, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, CH, CY, DE, DK, ES, FI, FR, GB, GR, IE, IT, LU, MC, NL, PT, SE)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)