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1. (WO2001001740) MICROFIBER DIELECTRICS WHICH FACILITATE LASER VIA DRILLING

Pub. No.:    WO/2001/001740    International Application No.:    PCT/US2000/016934
Publication Date: Fri Jan 05 00:59:59 CET 2001 International Filing Date: Wed Jun 21 01:59:59 CEST 2000
IPC: H05K 1/03
H05K 3/00
H05K 3/46
Applicants: ALLIEDSIGNAL INC.
Inventors: HAAS, David, R.
MCAULIFFE, Mavyn
XU, Chengzeng
Title: MICROFIBER DIELECTRICS WHICH FACILITATE LASER VIA DRILLING
Abstract:
This invention concerns electronic substrates comprising a non-woven filler material cousisting primarily of micro-fiber glass, and a resin material. The present invention also includes electronic products manufactured from the electronic substrates of this invention including, but not limited to prepregs (16, 18), metal clad laminates, and printed wiring boards with and without lased via holes (20). The present invention further includes a method of manufacturing printed built-up wiring boards including the steps of forming a prepreg (16, 18) and forming at least one via (20) in the prepreg (16, 18).